FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
Avnet, Portescap, TI launch Analog eLab videocast series
Avnet Electronics Marketing, Portescap, and Texas Instruments Inc. (TI) have launched a new 10-part, videocast series covering design ideas using motor control products and solutions. »
Avnet MCU training videos deliver tips for faster programming
Avnet EMA unveils its Microcontroller Technology Spotlight series of multimedia instructional videos at its Online Technical Training Web site, delivering technology overviews and demonstrations on some of the most innovative microcontroller technology solutions in the market today. »
AuthenTec buys SafeNet’s Embedded Security Solutions Division
Boosting its security and identify management solutions portfolio, AuthenTec has acquired SafeNet, Inc.'s Embedded Security Solutions Division in a cash and stock transaction. AuthenTec will also become the exclusive worldwide supplier of SafeNet's SafeXcel security processor ICs. »
TI’s fully-integrated dual power driver reduces parts count by 80%
TI unveils a digital power dual synchronous-buck driver with integrated power MOSFETs, protection blocks and monitoring features, which helps save board space and reduce component count by as much as 80 percent compared to industry standards. »
TI multicore SoC delivers 5x performance
Aimed at simplifying the design of communications infrastructure equipment, TI unveils its SoC architecture based on its multicore DSPs that integrate fixed and floating point capabilities »
TI debuts OMAP 4 processor platform for mobile designers
Aimed at high-volume wireless OEMs and ODMs, TI unveiled its OMAP 4 processor platform at the Mobile World Congress this week. TI says the new platform is uniquely positioned to make features such as multiple displays, projection technology and gesturing capabilities a reality. »
iSuppli reveals iPad BOM
The mid-range, 3G-wireless version of Apple's iPad is expected to have a bill of materials (BOM) and manufacturing cost of $287.15, reports iSuppli. This will make it Apple's most profitable iPad product, according to a virtual teardown generated with the help of iSuppli's Mobile Handset Cost Model tool. »
Video processor reduces system cost, complexity, power and size
TI introduces the TMS320DM6467T, a DaVinci video processor aimed at the need for increased digital video quality, higher resolution and faster frame rates for video communications and security applications. »
TI claims highest power Class-D audio amplifiers for home entertainment
Capable of driving 600 watts, TI claims the TAS5630 and TAS5631Class-D audio amplifiers feature the highest stereo output power in the industry, more than twice that of the closest comparable devices. »
TI to demo industry’s first contactless charging eval kit
Speeding the design of devices that can charge without wires, TI plans to demonstrate what it says is the industry's first contactless charging evaluation kit at the 2010 Consumer Electronics Show (CES) with Fulton Innovation. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- ADI delivers RF transceiver for short-range wireless systems
March 16, 2010 | 2:51 pm
ADI unveils a RF transceiver that targets short-range wireless systems in the global 2.4-GHz ISM band, supporting both IEEE 802.15.4 based protocol standards at 250 Kbits/s and proprietary protocols up to 2 Mbits/s using GFSK/FSK modulation schemes on a single chip. - ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Archive for New Products »