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No price hikes ahead for LCDs despite glass-supply disruption
LCD panel prices are not expected to rise due to a manufacturing disruption at a Corning Inc. glass plant in Taiwan, according to iSuppli Corp. »
NAND flash spot pricing dips slightly
Spot prices for NAND flash memory devices slipped slightly overall because higher volume commodity MLC parts pulled down the average weighted spot pricing, according to the latest analysis from Gartner Inc. »
Spot pricing for DDR3 DRAMs fall, DDR2 increases
Spot pricing for leading-edge DDR3 devices fell last week, while the older DDR2 technology continues on an upward trend, reports Gartner Inc. »
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick.
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.