Tag Archive
Samsung debuts ‘green’ DDR3 DRAM
Samsung claims the industry’s first 2-gigibit (Gb), 30-nanometer-class DRAM, offering a reduced power consumption by up to 30 percent compared to 50-nm class DRAM. »
Cisco selects Avnet as specialty distributor for data center products in U.S., Canada
Avnet Technology Solutions has signed a distribution agreement with Cisco to become a high-value specialty distributor for its data center products in the U.S. and Canada. Avnet will help Cisco further expand its market penetration into the data center market through qualified value-added resellers (VARs). »
“Green” is the new gold
From eco-friendly computers and displays to smart-grid and renewable energy devices, this new "green" industry may deliver tremendous growth opportunities for the electronics industry. »
Molex iPass HD connector doubles data rate, bandwidth
Aimed at next-gen SAS speed and density requirements, Molex Inc. has introduced the iPass+ High Density (HD) system, referenced as mini-SAS HD in the SAS 2.1 standard. »
HP to buy 3Com for $2.7 billion
HP will purchase 3Com for $2.7 billion, which will significantly expand HP's Ethernet switching offering, add routing solutions and network security capabilities and strengthen the company's position in China. »
Digital power market readies for growth
Global sales of digital power semiconductors are set to increase to $821 million in 2013, up from $127 million in 2008, according to the latest research from iSuppli. »
Tiny VGA port protector integrates level shifting, buffering, ESD protection
Maxim Integrated Products has claimed the industry's smallest VGA port protector that integrates level shifting, buffering and ESD protection. »
Samsung: DRAMs and SSDs are the “dynamic duo” of server power savings
Samsung Electronics claims its DDR memory chips and SSDs have the potential to significantly lower server power consumption and reduce data center costs. The two technologies have the combined potential to save more than 10 percent of power usage per server, said Samsung. »
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick.
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.