FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
HP leads ranking of Top 20 OEM semiconductor spenders
Hewlett-Packard is projected to be the top OEM semiconductor spender in 2010, spending an estimated $12.6 billion this year, compared to $10.99 billion in 2009, according to iSuppli Corp. Total semiconductor spending in 2010 among OEMs and EMS providers will record double-digit increases, according to the market researcher. »
Novellus, IBM form 3-D TSV partnership
Aimed at advanced product applications that call for small form factors and low-power consumption, Novellus Systems and IBM Corp. are working on a joint development program to design a copper-based 3-D semiconductor through-silicon via (TSV) process leveraging Novellus' SABRE copper electroplating and VECTOR PECVD systems. »
iPad to drive IC growth for tablets
The Apple iPad promises to energize the emerging tablet PC segment, creating a potential semiconductor opportunity of more than $4.1 billion in 2014, reports In-Stat. Other winners include battery and display makers, according to the market research firm. »
C-MAC delivers high-temp dc/dc converters
C-MAC expands its agreement with CISSOID to integrate Vesuvio technology into high-temperature dc/dc converter designs featuring their latest Magma and Hyperion semiconductor devices. These new state-of-the-art modules offer improvements in efficiency and packaging density and provide multiple output voltages with life time operation at 225 degrees C, says C-MAC. »
Wolfson signs global agreement with Future Electronics
Wolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally. »
Semiconductor equipment buys to rebound in 2010, says iSuppli
Global spending on semiconductor manufacturing equipment is expected to rise by 46.8 percent in 2010 compared in 2009, aided by the chip industry's lean supply chain, bringing an end to three consecutive years of decline, reports market researcher iSuppli Corp. »
Auto IC market on the road to recovery in 2010
The automotive semiconductor market shows a recovery in 2010 along with steady growth for much of the decade ahead, with sales reaching $35 billion in 2017, according to a new report from Semicast. »
Expect lean IC inventories in Q1, says iSuppli
Global semiconductor suppliers are expected to maintain lean inventories in the first quarter of 2010 in order to maintain profitability amid uncertain economic conditions, according to iSuppli Corp. »
3D integration technology partnerships roll
Manufacturers and suppliers of advanced materials, substrates and systems are forming partnerships that allow the companies to share and advance the development and adoption of 3D packaging and semiconductors. »
“Green” is the new gold
From eco-friendly computers and displays to smart-grid and renewable energy devices, this new "green" industry may deliver tremendous growth opportunities for the electronics industry. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »