Tag Archive
Visteon to unveil connected car demo at CES 2010
Automotive systems provider Visteon Corp. will unveil its connected car demonstrator that delivers a flexible approach to providing Internet access in motor vehicles, including via the use of embedded phones, tethered mobile devices or USB connectivity cards, reports iSuppli Corp. »
Valens to showcase HDBaseT-compliant chipset at CES 2010
Valens Semi announces the availability of the industry's first HDBaseT-compliant chipset and development kits. The company will showcase uncompressed HD multimedia distribution powered by the VS100 semiconductor product family at CES 2010. »
RFaxis claims to revolutionize wireless markets with single-chip CMOS RF front-end IC
Fabless semi company RFaxis unveils its next-generation pure CMOS RF front-end integrated circuits (RFeIC) platform. Touted as a game-changing RF front-end technology to transform the wireless connectivity market, the new platform is said to bring the industry one step closer to delivering a complete wireless radio on a single CMOS silicon die. »
Top 15 articles for 2009
I would like to thank all our readers and advertisers for your support during the launch of Electronics Advocate this year. Here's a list of our top fifteen stories of 2009 (from Aug. to Dec.). Wishing you all a happy holiday season and prosperous New Year! »
Toshiba outperforms in the NAND flash memory market in Q3
Japan's Toshiba Corp. outperformed in the NAND flash memory market in the third quarter as its revenue surged during the period, according to iSuppli Corp. The No.-2 NAND flash supplier increased its NAND revenue by 47.5 percent to reach $1.4 billion, up from $924 million in the second quarter, reports the market researcher. »
PFC sheds light on THD
Worldwide legislation is addressing the use of PFC in offline power supplies to conserve energy resources, forcing power-supply manufacturers to have some type of PFC in their designs. This article addresses the misconception by some designers that an input current THD of less than 10% is required. »
IC makers target smart-meter market
TI and Freescale are beefing up their smart-meter product portfolios as utilities seek compliant metering solutions to meet energy-efficiency guidelines in the U.S and Europe. TI is expanding its smart metering line-up with 16 new MSP430 MCUs while Freescale has announced an advanced meter reference design, built on an optimized microcontroller technology. »
Semiconductor foundry market will likely thin ranks in 2010
Although the global semiconductor foundry market is set to return to growth in 2010, the ranks of top-tier, pure-play foundries are expected to be culled down to just three major players in the future, according to iSuppli Corp. »
Global chip sales improve in 2009, says iSuppli
iSuppli Corp. has upgraded its 2009 semiconductor forecast due to strong second quarter sequential growth, supply chain improvements and semiconductor demand trends. The market researcher now forecasts global chip sales will decline by 16.5 percent in 2009, compared to a 23 percent drop previously projected. »
Digital power market readies for growth
Global sales of digital power semiconductors are set to increase to $821 million in 2013, up from $127 million in 2008, according to the latest research from iSuppli. »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.