FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Tag Archive
AuthenTec buys SafeNet’s Embedded Security Solutions Division
Boosting its security and identify management solutions portfolio, AuthenTec has acquired SafeNet, Inc.'s Embedded Security Solutions Division in a cash and stock transaction. AuthenTec will also become the exclusive worldwide supplier of SafeNet's SafeXcel security processor ICs. »
Large LCD panel prices set to rise in Q1 while LED backlight pricing falls
While pricing for LED backlights will continue to drop in 2010 due to increased production volumes and improvements in technology, pricing for large-sized LCD panels is expected to rise in the first quarter as TV and PC makers build inventories. »
DRAM market to grow 40% in 2010, says iSuppli
iSuppli's preliminary forecast projects that the global DRAM market will reach $31.9 billion in 2010, up 40.4 percent from $22.7 billion in 2009, after three consecutive years of decline. DRAM revenues fell 3.7 percent in 2009, 25.1 percent in 2008 and 7.5 percent in 2007, according to the market researcher. »
Samsung delivers CMOS imagers for ultra-slim smart phones
Samsung Electronics has developed two new CMOS image sensors -- the 5-Mpixel S5K4E2 and the 3-Mpixel S5K5CA -- that offer high-performance, HD-capable solutions for the mobile phone market. »
iSuppli reveals iPad BOM
The mid-range, 3G-wireless version of Apple's iPad is expected to have a bill of materials (BOM) and manufacturing cost of $287.15, reports iSuppli. This will make it Apple's most profitable iPad product, according to a virtual teardown generated with the help of iSuppli's Mobile Handset Cost Model tool. »
Smartphone shipments grow 30% in Q4 2009, fierce competition ahead
Global smartphone shipments grew 30 percent year-over-year to reach a record 53 million units in the fourth quarter (Q4) of 2009, according to Strategy Analytics. The market research firm says this was the strongest period of growth since the third quarter of 2008. »
Valens to showcase HDBaseT-compliant chipset at CES 2010
Valens Semi announces the availability of the industry's first HDBaseT-compliant chipset and development kits. The company will showcase uncompressed HD multimedia distribution powered by the VS100 semiconductor product family at CES 2010. »
Toshiba outperforms in the NAND flash memory market in Q3
Japan's Toshiba Corp. outperformed in the NAND flash memory market in the third quarter as its revenue surged during the period, according to iSuppli Corp. The No.-2 NAND flash supplier increased its NAND revenue by 47.5 percent to reach $1.4 billion, up from $924 million in the second quarter, reports the market researcher. »
Notebook, monitor panels integrate touch and 3D functionality
Touch and 3D functionality are impacting the development of notebook PC and LCD monitor panels for 2010, according to DisplaySearch. TFT-LCD panel makers have also increased the use of Gen 5 fabs to produce mini-note (netbook) and notebook PC panels. »
Semi market shrinks 12.4%; top 20 IC makers ranked
Revenue for the global semiconductor industry fell 12.4 percent and only one of the Top-10 suppliers -- Samsung Electronics -- achieved growth in 2009, according to preliminary estimates from iSuppli Corp. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »