FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
Samsung mass produces 4-Gbit DDR3 DRAM
Samsung has started volume production of the industry's first low-power 4-Gbit DDR3 devices using 40-nm process technology. The high-density memory is expected to deliver significant power savings to data centers, server systems and high-end notebooks. »
Samsung debuts ‘green’ DDR3 DRAM
Samsung claims the industry’s first 2-gigibit (Gb), 30-nanometer-class DRAM, offering a reduced power consumption by up to 30 percent compared to 50-nm class DRAM. »
Samsung regains leadership in U.S. LCD-TV market
Samsung Electronics Co. Ltd. regained its No.-1 ranking in the U.S. LCD-TV marketing in the third quarter, pushing competitor Vizio Inc. into the No.-2 position, reports iSuppli Corp. »
Samsung ultra-thin multi-chip packaging cuts size in half
Samsung Electronics is claiming the industry's thinnest multi-die package that measures 0.6 mm in height. Designed initially for 32-gigabyte (GB) densities, the new memory package is half the thickness of a conventional memory package of eight stacked chips (or dies). »
Global OLED display market sets revenue record at $192M in Q2
The worldwide OLED display market has set a new revenue record, reaching $192 million in the second quarter of 2009, up 32 percent quarter-to-quarter and 22 percent year-to-year, reports DisplaySearch. »
Samsung shares ‘Smart and Green’ vision at annual Mobile Solutions Forum
Samsung Electronics held the sixth annual Samsung Mobile Solutions Forum at the Westin Taipei Hotel, where it highlighted major mobile device trends, shared insight into future mobile technologies, and featured a "Smart and Green Mobility" theme. The company also announced several new products and production ramp-ups. »
TFT-LCD panel makers invest in China fabs
Leading TFT-LCD panel makers including LG Display, Sharp and Samsung Electronics are eyeing investments in Chinese fabs, targeting China's LCD-TV market that is projected to become the largest in two to three years, reports Displaybank. »
Samsung: DRAMs and SSDs are the “dynamic duo” of server power savings
Samsung Electronics claims its DDR memory chips and SSDs have the potential to significantly lower server power consumption and reduce data center costs. The two technologies have the combined potential to save more than 10 percent of power usage per server, said Samsung. »
Samsung offers first TCO-certified netbook
Samsung Electronics Co., Ltd. claims to offer the industry's first netbook certified to the TCO environmental and usability standard. The TCO-certified N120 ultra-light netbook is free from mercury and other hazardous materials. The company also touts the netbook's energy efficiency and ergonomically designed keyboard and display. »
Samsung selects Corning glass for UltraTouch mobile phones
Corning Incorporated has announced that the company's Gorilla glass was selected as the protective cover glass for Samsung UltraTOUCH mobile phones. The damage-resistant cover glass is said to withstand high-volume user interaction. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »