FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
Samsung debuts ‘green’ DDR3 DRAM
Samsung claims the industry’s first 2-gigibit (Gb), 30-nanometer-class DRAM, offering a reduced power consumption by up to 30 percent compared to 50-nm class DRAM. »
AMCC renames company to better reflect product focus
Applied Micro Circuits Corp. has announced its new name as AppliedMicro to reflect the company's focus on energy-efficient and cost optimized semiconductor devices for embedded computing, telecommunications and networking applications. The company is striving to reduce the power consumption of its products by as much as 50 percent. »
Avnet recognized for improving data-center efficiency
Avnet was named an Honoree in Storage Networking World's "Best Practices in Storage" Awards Program, and was also recognized in the "Green Computing, Energy Efficiency and the Data Center" category based on the redesign of its data center to decrease power consumption. »
Audio converter/driver IC saves space, power use
STMicroelectronics' TS4657 audio converter/driver IC not only simplifies the design of set-top boxes and other consumer audio/video products, but it also eliminates the need for at least four external components while reducing power consumption by more than two-thirds, and improving sound quality, according to the company. »
Elpida claims first 2-Gbit DDR2 mobile RAM
Elpida Memory, Inc. has claimed the industry's first 2-gigabit DDR2 Mobile RAM that can operate at 1.2 V while achieving a high-speed data transfer rate of 800 Mbps. »
VDSL access chipsets claim power consumption breakthrough at sub 1-W
Ikanos Communications unveils its next-generation family of highly integrated, low-power VDSL access chipsets. The sixth-generation Ikanos Velocity chipsets, targeted at high-density central office (CO) devices, provide up to 100 Mbits/s symmetric bandwidth and operate at sub 1-watt (W) per port. »
Samsung: DRAMs and SSDs are the “dynamic duo” of server power savings
Samsung Electronics claims its DDR memory chips and SSDs have the potential to significantly lower server power consumption and reduce data center costs. The two technologies have the combined potential to save more than 10 percent of power usage per server, said Samsung. »
Tiny boost converter reduces power use in portable displays by 55%
National Semiconductor claims the industry's smallest white LED driver with dynamic display backlight control that claims to reduce power consumption of portable displays by up to 55 percent. »
SOI technology delivers 30%+ power reduction for chips, systems
Silicon-on-insulator (SOI) technology can deliver significant energy-savings, about 30 to 40 percent power reduction for chips and systems, which will contribute to global initiatives that call for a reduction in electric power demand, according to the SOI Industry Consortium. »
CAN transceivers cut required components by 50%
Designed to simplify system design and layout, Texas Instruments claims the industry's first isolated CAN transceiver. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »