FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
Memory to drive IC growth in 2010; mixed pricing trends ahead
PCs and memory ICs will be the primary drivers for semiconductor revenue growth in 2010 with the market on track to reach $304 billion in 2012, according to Gartner Inc. The market researcher says rising DRAM prices, coupled with strong PC demand, will drive a 55 percent growth rate in DRAM revenue this year,... »
Top 15 articles for 2009
I would like to thank all our readers and advertisers for your support during the launch of Electronics Advocate this year. Here's a list of our top fifteen stories of 2009 (from Aug. to Dec.). Wishing you all a happy holiday season and prosperous New Year! »
Samsung ultra-thin multi-chip packaging cuts size in half
Samsung Electronics is claiming the industry's thinnest multi-die package that measures 0.6 mm in height. Designed initially for 32-gigabyte (GB) densities, the new memory package is half the thickness of a conventional memory package of eight stacked chips (or dies). »
Memory pricing surges higher
Spot pricing for DDR2 DRAMs jumped about 20 percent compared to the previous week, and is now priced higher than DDR3 devices, according to the latest analysis from Gartner Inc. DDR3 pricing also edged up slightly last week, according to the market research company. »
Pricing continues to rise for DDR2, DDR3 and NAND memory devices
Contract pricing for DDR2 and DDR3 DRAMs and NAND memory devices continue to increase, according to the latest pricing analysis by Gartner Inc. »
Spot pricing for DRAMs and NAND continue to fall
Spot pricing is down again for DRAMs and NAND flash devices, according to market research firm Gartner Inc. However, spot pricing for DRAMs fell slightly by 1.9 percent with a range of -3.9 percent to 3.7 percent. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- IRC current-sense resistors deliver high thermal performance
February 26, 2010 | 5:39 pm
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments. - Maxim PMIC integrates three regulators
February 26, 2010 | 5:25 pm
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels. - Archive for New Products »