Tag Archive
TI multicore SoC delivers 5x performance
Aimed at simplifying the design of communications infrastructure equipment, TI unveils its SoC architecture based on its multicore DSPs that integrate fixed and floating point capabilities »
TI debuts OMAP 4 processor platform for mobile designers
Aimed at high-volume wireless OEMs and ODMs, TI unveiled its OMAP 4 processor platform at the Mobile World Congress this week. TI says the new platform is uniquely positioned to make features such as multiple displays, projection technology and gesturing capabilities a reality. »
Programmable HD video and imaging platform targets low-power mobile devices
CEVA launches the CEVA-MM3000, a fully programmable, HD video and imaging platform specifically designed for connected portable multimedia and home entertainment devices. »
NEC, KWest partner on turnkey design for PC tablets
NEC and KWest unveil a turnkey design for portable consumer products that leverages NEC's EMMA Mobile 1 SoC, and KWest's Connected Media Framework. »
SiliconBlue to demo iCE65 mobileFPGA at MWC
SiliconBlue Technologies will showcase the newest members of its iCE65 mobileFPGA family at Mobile World Congress (MWC), February 15-18 in Barcelona. The company also plans to demo several products showing how mobileFPGA devices enable seamless feature integration for mobile applications. »
Jabil to demo breakthrough mobility technologies
Jabil Circuit plans to demo several new components and technologies at the Mobile World Congress in Barcelona that the company says will provide critical differentiation, cost efficiencies and faster time to market for the mobility industry. »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.