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Part 3 of 3: Trends in advanced IC Packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »

Part 2 of 3: Trends in advanced IC packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »

Part 1 of 3: Trends in advanced IC packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 &... »

MEMS microphone shipments to reach 1 billion in 2013, says researcher

By Gina Roos

Global shipments of microelectromechanical system (MEMS) microphones are set to more than triple from 2008 to 2013 due to their strong acceptance in mobile handsets and other applications, according to iSuppli Corp. »

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