Tag Archive
Power IC market grew 43% in 2010
The power semiconductor discrete and module market returned to growth in 2010, growing 43 percent to reach nearly $16 billion, according to IMS Research. »
Single-chip processors still find homes in handsets
The projected demise of dedicated, single-chip solutions for mobile phones has been exaggerated, according to a new report from ABI Research. »
IBM to produce Infineon security chips at U.S. foundry
Infineon Technologies AG has announced that IBM will manufacture Infineon-designed highly-secure ICs used for secure identification applications, including electronic passports compliant with international travel regulations and the U.S. Personal Identity Verification (PIV) cards. »
Infineon takes top spot for automotive ICs, Freescale slips to third
Infineon Technologies outsold Freescale Semiconductor as the leading supplier of semiconductors to the automotive industry in 2009, according to a report from Semicast Research. »
Infineon debuts slim SMD package for HV power MOSFETs
Infineon intros the ThinPAK 8x8, a new leadless SMD package for HV MOSFETs. The new package measures 64mm² (vs. 150mm² for the D2PAK) with a very low profile of 1-mm high (vs. 4.4 mm for the D2PAK), enabling the design of slimmer power supply enclosures. »
SiC Schottky diode demand takes off in 2009
The silicon carbide (SiC) Schottky diode market grew 25 percent in 2009, compared to the previous year, reaching an estimated $29 million, reports IMS Research. »
Fairchild, Infineon standardize on packaging for power MOSFETs
Fairchild Semiconductor and Infineon Technologies have announced a packaging partnership for their power MOSFETs in the MLP 3x3 (Power33 or S3O8) and PowerStage 3x3 packages. »
DA5 consortium to develop high-lead solder alternatives
Bosch, Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics have formed a consortium to develop alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing. The new DA5 consortium is soliciting input from die attach material suppliers to jointly evaluate and develop possible alternatives. »
EU partnership launches research project on cooling semiconductors
A European partnership, consisting of semiconductor manufacturers, electronic design automation (EDA) suppliers, research institutions and universities, has launched a three-year project, looking at the impact of thermal effects on electronic circuits and systems. »
Global IC revenue fell 10.5% in 2009, DRAM prices climb
The global semiconductor market reached $228.4 billion in 2009, down $26.8 billion, or 10.5 percent from 2008, marking two consecutive years of revenue declines, reports Gartner. »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.