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Distribution rules in 2010

By Gina Roos

Electronics Advocate readers have spoken. Distribution was the hot topic for 2010 with three of our top ten feature articles focused on leading distributors in North America and the state of the industry. Trends in advanced IC packaging also garnered a lot of interest this year. »

Part 3 of 3: Trends in advanced IC Packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »

Part 2 of 3: Trends in advanced IC packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »

Part 1 of 3: Trends in advanced IC packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 &... »

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