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FCI I/O connector micro-site simplifies product selection

By Gina Roos

FCI has developed a dedicated, micro-site for I/O (input/output) connector solutions. The micro-site provides customers with a Web-based interface with direct access to interactive product selectors. »

Samsung ultra-thin multi-chip packaging cuts size in half

By Gina Roos

Samsung Electronics is claiming the industry's thinnest multi-die package that measures 0.6 mm in height. Designed initially for 32-gigabyte (GB) densities, the new memory package is half the thickness of a conventional memory package of eight stacked chips (or dies). »

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