Tag Archive
PCB shipments, orders down in July
Shipments of rigid PCBs and flexible circuits in July 2011 decreased 12.1 percent from July 2010, while orders booked decreased 16.0 percent from July 2010, according to the monthly North American Printed Circuit Board (PCB) Statistical Program report from IPC — Association Connecting Electronics Industries. »
PCB shipments rise, book-to-bill slides in November
Shipments of rigid PCBs and flexible circuits increased 11.8 percent in November 2010 from November 2009, while orders booked rose 5.0 percent from November 2009, according to IPC -- Association Connecting Electronics Industries. »
PCB book-to-bill ratio continues to climb
North American shipments for both rigid printed circuit boards (PCBs) and flexible circuits in April 2010 increased 30.7 percent from April 2009, as orders booked increased 37.6 percent from April 2009, according to the monthly North American PCB industry report from IPC -- Association Connecting Electronics Industries. Year to date, combined industry shipments... »
IPC updates January standards meetings
IPC's latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee. »
PCB industry shipments and bookings increase in August
IPC -- Association Connecting Electronics Industries announced that North American industry shipments in August 2009 for rigid printed circuit boards (PCBs) and flexible circuits increased 4.5 percent and bookings climbed 13.1 percent compared to the previous month. The combined (rigid and flex) industry book-to-bill ratio in August 2009 held steady at 1.07. »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.