FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
Fairchild CCM PFC controller minimizes power losses, cuts 54 external components
Fairchild Semi offers a CCM PFC controller aimed at helping power electronic design teams push efficiency towards 100 percent to meet ENERGY STAR regulations and to reduce their carbon footprint. The FAN6982 delivers high system efficiency, high power factor and low total harmonic distortion (THD) to minimize power losses in multi-stage power supplies. »
Samsung mass produces 4-Gbit DDR3 DRAM
Samsung has started volume production of the industry's first low-power 4-Gbit DDR3 devices using 40-nm process technology. The high-density memory is expected to deliver significant power savings to data centers, server systems and high-end notebooks. »
DOE issues energy-efficiency metrics for data centers
The U.S. Department of Energy (DOE), together with the Environmental Protection Agency (EPA) and industry leaders, have agreed on energy-efficiency measurements, metrics, and reporting guidelines for data-center facilities. »
Electronics companies, retailers to simplify ‘green’ electronics purchasing for consumers
The Sustainability Consortium, along with leading electronics companies and retailers, plans to establish a system to help consumers identify "green" electronics. Partners include Dell, HP, Intel, Toshiba, Best Buy and Walmart. Initial results will be available in the third quarter of 2010. »
PWM controllers improve efficiency at light loads
Fairchild Semi offers a portfolio of pulse-width modulated (PWM) controllers, which enable notebook power-supply designers to meet international energy-saving regulations. »
DOE: Appliance makers need to comply with new standards by January 8
Appliance makers have 30 days (Jan. 8) to demonstrate compliance with the U.S. Department of Energy's energy-efficiency standards. Separately, the DOE has banned certain LG French-door refrigerator-freezers from using the ENERGY STAR label effective January 2, 2010, as part of its broader effort to expand enforcement. »
“Green” is the new gold
From eco-friendly computers and displays to smart-grid and renewable energy devices, this new "green" industry may deliver tremendous growth opportunities for the electronics industry. »
EPA sets new Energy Star requirements for A/V equipment
The U.S. Environmental Protection Agency (EPA) is tackling the energy consumption of another piece of electronics equipment in a quest to reduce energy costs and carbon emissions. This time the EPA has announced new requirements for audio/video (A/V) products to earn the Energy Star label. »
NXP delivers fully integrated 45-nm SoC platform
NXP Semiconductors unveils a family of highly integrated SoC products that enable high-performance solutions for mainstream HD DVRs and STB platforms in global satellite, cable and IPTV networks. »
Study: Video calibration improves energy efficiency of HDTVs
The THX study, which evaluated plasma and LCD HDTV performance, finds that video calibration improves energy efficiency by up to 50 percent, depending on the display's technology platform, screen size and model year. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »