FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Tag Archive
HP leads ranking of Top 20 OEM semiconductor spenders
Hewlett-Packard is projected to be the top OEM semiconductor spender in 2010, spending an estimated $12.6 billion this year, compared to $10.99 billion in 2009, according to iSuppli Corp. Total semiconductor spending in 2010 among OEMs and EMS providers will record double-digit increases, according to the market researcher. »
Soitec supplies SOI substrates to CSMC for PDP drivers, other ICs
The Soitec Group has inked a deal to supply SOI substrates to CSMC Technologies, a pure-play specialty analog foundry based in China. Soitec is sampling SOI substrates for high voltage (HV) and CMOS applications initially targeted at color plasma display panel (PDP) driver ICs and other mixed-signal and analog applications. The company says chip... »
Asia to account for 39% of smartphone shipments in 2015
Smartphone shipments to Asia are expected to more than quadruple by 2015, accounting for 39 percent of total smartphone shipments in 2015, reports IMS Research. »
Novellus, IBM form 3-D TSV partnership
Aimed at advanced product applications that call for small form factors and low-power consumption, Novellus Systems and IBM Corp. are working on a joint development program to design a copper-based 3-D semiconductor through-silicon via (TSV) process leveraging Novellus' SABRE copper electroplating and VECTOR PECVD systems. »
IPC calls for revised RoHS Directive based on science, aligned with REACH
IPC -- Association Connecting Electronics Industries is urging members of the EU Council and Parliament to ensure that the revised RoHS Directive be scientifically based and fully aligned with the REACH Regulation, according to the organization's new white paper. »
ADI delivers RF transceiver for short-range wireless systems
ADI unveils a RF transceiver that targets short-range wireless systems in the global 2.4-GHz ISM band, supporting both IEEE 802.15.4 based protocol standards at 250 Kbits/s and proprietary protocols up to 2 Mbits/s using GFSK/FSK modulation schemes on a single chip. »
Global computer storage market to grow in 2010
The global market for hard disk drives (HDDs) and optical disk drives (ODDs) used in computers is expected to climb as the PC market continues to strengthen, reports iSuppli Corp. The market researcher expects global revenue of HDD shipments to reach $27.7 million in 2010, up 18.4 percent from $23.4 billion in 2009. ODD... »
Avnet MCU training videos deliver tips for faster programming
Avnet EMA unveils its Microcontroller Technology Spotlight series of multimedia instructional videos at its Online Technical Training Web site, delivering technology overviews and demonstrations on some of the most innovative microcontroller technology solutions in the market today. »
Applied Materials expands display, solar equipment manufacturing
Applied Materials, a supplier of equipment to the semiconductor, flat panel display (FPD) and solar photovoltaic (PV) industries, recently opened its newly expanded Tainan Manufacturing Center in Tainan, Taiwan. »
iSuppli: Semiconductor industry at most profitable level in a decade
The global semiconductor industry is more profitable than it has been at any time in the last decade, thanks to increasingly aggressive management of costs, capacity and competitive positioning, according to iSuppli Corp. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »