FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
Archive for FEATURES »
Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Tag Archive
Global computer storage market to grow in 2010
The global market for hard disk drives (HDDs) and optical disk drives (ODDs) used in computers is expected to climb as the PC market continues to strengthen, reports iSuppli Corp. The market researcher expects global revenue of HDD shipments to reach $27.7 million in 2010, up 18.4 percent from $23.4 billion in 2009. ODD... »
National claims first PMBus and protection IC
National Semi claims the industry's first system monitoring, protection and control IC with on-chip PMBus support. Launched at APEC, the LM25066 provides designers of blade servers, storage networking systems, routers/switches and modular subsystems with a solution that improves system reliability and reduces operating expenses in data centers. »
Samsung mass produces 4-Gbit DDR3 DRAM
Samsung has started volume production of the industry's first low-power 4-Gbit DDR3 devices using 40-nm process technology. The high-density memory is expected to deliver significant power savings to data centers, server systems and high-end notebooks. »
DOE issues energy-efficiency metrics for data centers
The U.S. Department of Energy (DOE), together with the Environmental Protection Agency (EPA) and industry leaders, have agreed on energy-efficiency measurements, metrics, and reporting guidelines for data-center facilities. »
DOE awards $47M for energy-efficient IT projects
The U.S. Department of Energy (DOE) is awarding $47 million for 14 projects to support the development of new technologies that can improve energy efficiency in the information technology (IT) and communication technology sectors including data processing, data storage and telecommunications. »
AMCC renames company to better reflect product focus
Applied Micro Circuits Corp. has announced its new name as AppliedMicro to reflect the company's focus on energy-efficient and cost optimized semiconductor devices for embedded computing, telecommunications and networking applications. The company is striving to reduce the power consumption of its products by as much as 50 percent. »
Molex iPass HD connector doubles data rate, bandwidth
Aimed at next-gen SAS speed and density requirements, Molex Inc. has introduced the iPass+ High Density (HD) system, referenced as mini-SAS HD in the SAS 2.1 standard. »
HP to buy 3Com for $2.7 billion
HP will purchase 3Com for $2.7 billion, which will significantly expand HP's Ethernet switching offering, add routing solutions and network security capabilities and strengthen the company's position in China. »
Samsung: DRAMs and SSDs are the “dynamic duo” of server power savings
Samsung Electronics claims its DDR memory chips and SSDs have the potential to significantly lower server power consumption and reduce data center costs. The two technologies have the combined potential to save more than 10 percent of power usage per server, said Samsung. »
Green PC market to exceed $190 billion by 2013, says researcher
Computer and server vendors are making their products increasingly green with the newest equipment consuming less electricity than legacy hardware, toxic substances being replaced with more environmentally friendly materials, and most vendors taking their products back at end of life cycle for reuse/recycling, according to a new study by NextGen Research, Oyster Bay, N.Y »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »