Tag Archive
Tiny encoder saves PCB space, cuts cost
Avago unveils the industry's smallest three-channel reflective encoder. »
SMSC to buy Conexant Systems for $284M
SMSC is buying Conexant Systems, a supplier of semiconductor solutions for imaging, audio, embedded modem, and video surveillance applications, for $284 million. »
Power management IC market to grow nearly 40% in 2010
The power management semiconductor market will reach $31.4 billion in 2010, up 39.9 percent from $22.4 billion in 2009, according to a new report from iSuppli Corp. This year's expansion will reverse the losses of 2009, which declined 15.8 percent, and is expected to yield the highest growth rate during the next four years. »
ON Semi to buy Sanyo’s chip business
ON Semiconductor will purchase Sanyo Semiconductor, a subsidiary of Sanyo Electric Co. Ltd., and other assets related to its semiconductor business, for $366 million in a cash and stock transaction. The acquisition is expected to boost ON Semi's manufacturing scale, broaden its product portfolio and expand its presence in the Japanese market. »
Flextronics to build power facility in China
Flextronics plans to develop a power manufacturing and service facility in Ganzhou, Jiangxi, aimed at supporting telcommunications, computing and consumer OEMs. »
Atmel delivers smaller, lighter and faster MCUs
Atmel announces production availability for the industry's smallest flash AVR microcontroller package. The Atmel ATtiny4, ATtiny5, ATtiny9 and ATtiny10 AVR microcontrollers (MCUs) are housed in an ultra-small 8-pad UDFN package, with a dimension of 2 x 2 x 0.6 mm, and weigh less than 8 mg »
NRC announces Kemet franchise agreement
NRC Electronics has announced a franchise agreement with Kemet Electronics that covers its complete line of capacitor products and technologies. »
Silicon magnetic sensor market poised for growth
Strong growth is projected for the silicon magnetic sensor market in 2010 as demand increases from the automotive, industrial and consumer markets, according to iSuppli Corp. »
STATS ChipPAC ramps eWLB production capacity
STATS ChipPAC, a semiconductor test and advanced packaging service provider, has ramped its first generation embedded wafer-level ball grid array (eWLB) technology to high volume production. The company said it is positioned to double production unit volume by the end of 2009. »
Weathering the recession storm, Part 4
If there is one thing that leading suppliers in the electronics industry agree on is that the downturn hit fast and steep. As a result, most suppliers moved quickly to reduce cost by consolidating plants, cutting their employee headcount, and pruning product lines. Here's our interview with Allan Lam, Fairchild Semiconductor's EVP, worldwide sales... »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.