Tag Archive
iSuppli teardown reveals $171.05 BOM for BlackBerry Torch
The new Blackberry Torch 9800 smart phone from Research in Motion Ltd. carries a bill of materials (BOM) of $171.05, according to a teardown and cost analysis conducted by market research firm iSuppli Corp. »
ST 3-axis accelerometer delivers reduced power consumption
ST expands its motion-sensor portfolio with a 3-axis digital-output accelerometer that features significantly reduced power consumption -- more than 90 percent lower than available solutions on the market, according to the company. The LIS3DH accelerometer also delivers a small footprint -- 3 x 3 x 1 mm and enhanced functionality. »
Tri-axis vibration sensor enables easy factory maintenance
ADI's tri-axis, wide-bandwidth, embedded vibration sensor enables simple and affordable manufacturing equipment condition monitoring in a 15 x 15 x 15-mm module. »
Chipworks iPad teardown reveals no major surprises
Apple has followed the same approach -- using lower cost technology while focusing on design and usability -- to develop the iPad as it did for its iPod and iPhone products, according to a bill-of-materials (BOM) teardown of the iPad from Chipworks. »
Freescale delivers energy-efficient 3-axis accelerometer
Designed to enhance mobile consumer experiences with improved motion detection, Freescale intros the MMA8450Q 3-axis accelerometer. »
Northern Power selects Analog Devices’ SHARC processors for wind turbines
Analog Devices, Inc. says its ADI SHARC digital signal processors (DSPs) have been designed into Northern Power Systems' flagship Northwind 100 community-scale wind turbines. »
MPLAB starter kit for PIC18 MCUs eases low-power USB designs
Microchip Technology has launched the MPLAB Starter Kit for PIC18 microcontrollers, which contains all of the components, documentation, schematics, debugging and programming capabilities needed to evaluate the high-performance PIC18 8-bit microcontroller family in low-power USB and touch-sensing applications. »
iSuppli teardown: iPhone 3G S BOM and manufacturing cost is $178.96
The teardown of the iPhone 3G S shows that the product's component selection has had some interesting changes in parts and suppliers, according to iSuppli Corp.’s Teardown Analysis Service. »
Avnet brings MD&M East show to designers
Avnet is offering five brief video versions of what it exhibited at the recent Medical Design & Manufacturing (MD&M) East show. »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.