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Part 3 of 3: Trends in advanced IC Packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »

Part 2 of 3: Trends in advanced IC packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »

Part 1 of 3: Trends in advanced IC packaging

By John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin

Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 &... »

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