Samsung has started volume production of the industry's first low-power 4-Gbit DDR3 devices using 40-nm process technology. The high-density memory is expected to deliver significant power savings to data centers, server systems and high-end notebooks. »
Altium makes gains in N. American EDA market
Altium, a provider of electronic design software, is making headway in the North American market. The company says its North American operation alone has gained more than 500 new U.S. customers over the past 12 months for its electronics design solution Altium Designer. »
Power Integrations launches EuP standards finder
Power Integrations launches its new EuP Standards Finder, an online tool for power supply designers that matches end products to energy-efficiency requirements. The tool provides designers with immediate access to specific requirements of the European Commission's EuP Ecodesign Directive. »
Part 3 of 3: Trends in advanced IC Packaging
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »
Large LCD panel prices set to rise in Q1 while LED backlight pricing falls
While pricing for LED backlights will continue to drop in 2010 due to increased production volumes and improvements in technology, pricing for large-sized LCD panels is expected to rise in the first quarter as TV and PC makers build inventories. »
FCI acquires MergeOptics
FCI, a leading manufacturer and provider of connector and cable assembly solutions, has acquired the assets of MergeOptics, a manufacturer of active optical cables (AOCs) and optical transceivers. Information Gatekeepers projects the AOC market to reach 48 million units by 2014. »
DOE issues energy-efficiency metrics for data centers
The U.S. Department of Energy (DOE), together with the Environmental Protection Agency (EPA) and industry leaders, have agreed on energy-efficiency measurements, metrics, and reporting guidelines for data-center facilities. »
IPC APEX conference to provide solutions for lead-free challenges
IPC's technical conference will address a host of unintended consequences as a result of the lead ban in electronics devices, implemented as part of the EU's RoHS Directive about four years. Some of those issues include new defects, reliability concerns, processing issues and challenges for high-reliability sectors, says IPC. »
DRAM market to grow 40% in 2010, says iSuppli
iSuppli's preliminary forecast projects that the global DRAM market will reach $31.9 billion in 2010, up 40.4 percent from $22.7 billion in 2009, after three consecutive years of decline. DRAM revenues fell 3.7 percent in 2009, 25.1 percent in 2008 and 7.5 percent in 2007, according to the market researcher. »
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick.
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.