Supply Chain
Soitec supplies SOI substrates to CSMC for PDP drivers, other ICs
The Soitec Group has inked a deal to supply SOI substrates to CSMC Technologies, a pure-play specialty analog foundry based in China. Soitec is sampling SOI substrates for high voltage (HV) and CMOS applications initially targeted at color plasma display panel (PDP) driver ICs and other mixed-signal and analog applications. The company says chip... »
IBM is first IC maker to eliminate PFOS and PFOA in supply chain
IBM has eliminated perfluorooctane sulfonate (PFOS) and perfluorooctanoic acid (PFOA) compounds from its chip making processes as part of its design for the environment program. »
GM to improve manufacturing processes with help from HP and Apriso
HP Enterprise Services has been selected by General Motors to implement an Apriso solution for better control over its battery manufacturing and supply chain operations at its new Chevrolet Volt battery assembly plant. »
Large-LCD panel makers face double whammy: profitability issues, LED shortages
As large LCD panel suppliers continue to struggle to maintain profitability, many are forced to cut materials and components costs despite high growth in this market over the past few years, reports iSuppli. Adding to the challenge is a global shortage of LEDs, primarily impacting large-screen LCD TVs, which may continue throughout the year... »
Memory to drive IC growth in 2010; mixed pricing trends ahead
PCs and memory ICs will be the primary drivers for semiconductor revenue growth in 2010 with the market on track to reach $304 billion in 2012, according to Gartner Inc. The market researcher says rising DRAM prices, coupled with strong PC demand, will drive a 55 percent growth rate in DRAM revenue this year,... »
Large LCD panel prices set to rise in Q1 while LED backlight pricing falls
While pricing for LED backlights will continue to drop in 2010 due to increased production volumes and improvements in technology, pricing for large-sized LCD panels is expected to rise in the first quarter as TV and PC makers build inventories. »
Ford breaks from tradition; outsources to EMS provider
With the introduction of the company's second-generation SYNC system, the MyFord platform, Ford Motor Company also marks a change in the company's supplier strategy to using an electronics manufacturing services (EMS) provider to make the system, reports iSuppli. »
iSuppli reveals iPad BOM
The mid-range, 3G-wireless version of Apple's iPad is expected to have a bill of materials (BOM) and manufacturing cost of $287.15, reports iSuppli. This will make it Apple's most profitable iPad product, according to a virtual teardown generated with the help of iSuppli's Mobile Handset Cost Model tool. »
Verical purchasing tool cuts sourcing time
Verical, an online outlet for electronic components, has launched DemandMatch, a bulk parts search tool that matches open requirements with available supply automatically. »
LCD desktop monitor production spikes in January
January LCD monitor production for top PC and monitor brands, which is about 85 percent of the market, was 12.5 million units, the highest level in more than a year, according to a new report from DisplaySearch. The market researcher says it's too early to determine if it indicates a recovery or double booking... »
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies.
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency.