FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Renewable Energy
AMSC receives $70M order from Chinese wind turbine maker
AMSC receives an initial $70-million order for complete wind turbine electrical control systems from China's Shenyang Blower Works (SBW). »
DOE invests $12M in solar technologies
The U.S. Department of Energy's National Renewable Energy Laboratory (NREL) will invest up to $12 million in four companies to support the development of early stage solar energy technologies and help them advance to full commercial scale. The companies are Alta Devices, Solar Junction, Tetra Sun and Semprius. »
U.S. wind energy industry installs nearly 10,000 MW in 2009, manufacturing lags behind
The U.S. wind industry installed 10,000 megawatts of new generating capacity in 2009, breaking all previous records, but still lags in manufacturing, according to the American Wind Energy Association »
Bachmann selects ADI converters for wind-to-power conversion
Bachmann electronic, a manufacturer of electronic control systems in wind turbines, has selected Analog Device's data converters as key components in its control systems for wind turbines and other industrial systems. Bachmann's electronic control systems have a proven availability of more than 99.96 percent and play an essential role in enabling 30,000 wind power... »
AMSC to develop 5-MW wind turbines with China’s Dongfang Turbine
American Superconductor Corp., a global power technologies company, has expanded its relationship with China's third largest wind turbine manufacturer, Dongfang Turbine Co. Ltd. »
Enel, Sharp, ST to form largest solar panel plant in Italy
Enel Green Power, Sharp and STMicroelectronics have signed an agreement for the manufacture of triple-junction thin-film photovoltaic panels in Italy, touted as the largest photovoltaic panel manufacturing plant in the country. »
AWEA: Top wind power trends in 2010
As renewable energy dominates economic and energy issues in the U.S., the American Wind Energy Association (AWEA) has identified several trends and indicators to watch in 2010. »
Northern Power selects Analog Devices’ SHARC processors for wind turbines
Analog Devices, Inc. says its ADI SHARC digital signal processors (DSPs) have been designed into Northern Power Systems' flagship Northwind 100 community-scale wind turbines. »
“Green” is the new gold
From eco-friendly computers and displays to smart-grid and renewable energy devices, this new "green" industry may deliver tremendous growth opportunities for the electronics industry. »
DOE awards $620M for smart-grid demo projects
The U.S. Department of Energy (DOE) is awarding $620 million for 32 projects across the nation to demonstrate advanced smart-grid technologies and integrated systems that will help build a smarter and more efficient electrical grid. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »