FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Power
C-MAC delivers high-temp dc/dc converters
C-MAC expands its agreement with CISSOID to integrate Vesuvio technology into high-temperature dc/dc converter designs featuring their latest Magma and Hyperion semiconductor devices. These new state-of-the-art modules offer improvements in efficiency and packaging density and provide multiple output voltages with life time operation at 225 degrees C, says C-MAC. »
Power switch improves off-line power supply supply designs
Fairchild Semiconductor claims the FSGM0565R is the only power switch in the industry that integrates drain-current sensing in a 650-V internal avalanche-rugged SenseFET, reducing power dissipation and improving reliability by shortening the over-current time delay to less than 200 ns. »
National Semi launches power module family
Claiming accelerated time-to-market and superior thermal and EMI performance, National Semiconductor unveils the first three products in its SIMPLE SWITCHER power module family. Designed to take ease-of-use to the next level, National also launched its WEBENCH Power Architect that allows engineers to quickly design multiple-output, high-performance dc/dc power supplies for an entire system. »
Avnet, TI, Xilinx launch Analog eLab Videocast
Avnet, TI and Xilinx have launched a new Analog eLab videocast series that demos TI's digital power technology in Xilinx FPGA-based designs. »
National Semi’s WEBENCH tool enables real-time comparison of power solutions
National Semiconductor Corp. has introduced WEBENCH Visualizer, a comparison and selection tool that enables engineers to rapidly select an optimal power system design. It also creates a graphical snapshot of options across multiple criteria, such as power efficiency, footprint and system bill of materials (BOM) cost. »
NXP sets new benchmarks for LED drivers, launches online SSL design tool
NXP Semiconductors has announced its SSL2101 LED driver IC matches LED lifetimes in an accelerated lifetime test. The company also announced the introduction of the SSL 2102 integrated dimmable mains LED driver IC for SSL retrofit lamps and modules, and the launch of its online design tool for SSL applications, which makes it easy... »
TTI launches power management webcast series
TTI, Inc., a global distributor of passive, connector, electromechanical, and discrete components, has released two Power Management Webcasts in the wake of its Power Management Resource Center launch last month. »
Power Integrations launches online courses for power-supply design engineers
Power Integrations has launched PI University, an online technical learning center featuring practical instructional videos that deliver a complete how-to tutorial in power-supply circuit design. »
Digital power market readies for growth
Global sales of digital power semiconductors are set to increase to $821 million in 2013, up from $127 million in 2008, according to the latest research from iSuppli. »
TTI launches Power Management Resource Center
TTI, Inc., a global distributor of passive, connector, electromechanical and discrete components, has launched its new Power Management Resource Center, targeted as a one-stop power management resource for engineers. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »