FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
New Products
IRC current-sense resistors deliver high thermal performance
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments. »
Maxim PMIC integrates three regulators
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels. »
National claims first PMBus and protection IC
National Semi claims the industry's first system monitoring, protection and control IC with on-chip PMBus support. Launched at APEC, the LM25066 provides designers of blade servers, storage networking systems, routers/switches and modular subsystems with a solution that improves system reliability and reduces operating expenses in data centers. »
ST unveils SPEAr MPUs for embedded control
ST expands its SPEAr MPU family with the addition of four devices, each targeting specific embedded-control applications across market segments from computer peripherals and communication to industrial automation. »
TI’s fully-integrated dual power driver reduces parts count by 80%
TI unveils a digital power dual synchronous-buck driver with integrated power MOSFETs, protection blocks and monitoring features, which helps save board space and reduce component count by as much as 80 percent compared to industry standards. »
Freescale offers iMX Android eval kit
Freescale offers a new eval kit based on the Android platform and Freescale's i.MX51 processor. »
TI multicore SoC delivers 5x performance
Aimed at simplifying the design of communications infrastructure equipment, TI unveils its SoC architecture based on its multicore DSPs that integrate fixed and floating point capabilities »
Freescale beefs up DSP with enhanced acceleration engine
Freescale launches the MSC8155, a higher performance and cost-optimized version of the company's flagship MSC8156 DSP based on the latest StarCore technology. »
TI debuts OMAP 4 processor platform for mobile designers
Aimed at high-volume wireless OEMs and ODMs, TI unveiled its OMAP 4 processor platform at the Mobile World Congress this week. TI says the new platform is uniquely positioned to make features such as multiple displays, projection technology and gesturing capabilities a reality. »
Freescale delivers energy-efficient 3-axis accelerometer
Designed to enhance mobile consumer experiences with improved motion detection, Freescale intros the MMA8450Q 3-axis accelerometer. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- IRC current-sense resistors deliver high thermal performance
February 26, 2010 | 5:39 pm
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments. - Maxim PMIC integrates three regulators
February 26, 2010 | 5:25 pm
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels. - Archive for New Products »