New Products
ST joystick chip delivers low-power navigation to handhelds
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. »
Renesas Flash MCUs deliver energy-efficiency control systems
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. »
Fairchild CCM PFC controller minimizes power losses, cuts 54 external components
Fairchild Semi offers a CCM PFC controller aimed at helping power electronic design teams push efficiency towards 100 percent to meet ENERGY STAR regulations and to reduce their carbon footprint. The FAN6982 delivers high system efficiency, high power factor and low total harmonic distortion (THD) to minimize power losses in multi-stage power supplies. »
IRC current-sense resistors deliver high thermal performance
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments. »
Maxim PMIC integrates three regulators
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels. »
National claims first PMBus and protection IC
National Semi claims the industry's first system monitoring, protection and control IC with on-chip PMBus support. Launched at APEC, the LM25066 provides designers of blade servers, storage networking systems, routers/switches and modular subsystems with a solution that improves system reliability and reduces operating expenses in data centers. »
ST unveils SPEAr MPUs for embedded control
ST expands its SPEAr MPU family with the addition of four devices, each targeting specific embedded-control applications across market segments from computer peripherals and communication to industrial automation. »
TI’s fully-integrated dual power driver reduces parts count by 80%
TI unveils a digital power dual synchronous-buck driver with integrated power MOSFETs, protection blocks and monitoring features, which helps save board space and reduce component count by as much as 80 percent compared to industry standards. »
Freescale offers iMX Android eval kit
Freescale offers a new eval kit based on the Android platform and Freescale's i.MX51 processor. »
TI multicore SoC delivers 5x performance
Aimed at simplifying the design of communications infrastructure equipment, TI unveils its SoC architecture based on its multicore DSPs that integrate fixed and floating point capabilities »
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick.
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.