Manufacturing Trends
IBM is first IC maker to eliminate PFOS and PFOA in supply chain
IBM has eliminated perfluorooctane sulfonate (PFOS) and perfluorooctanoic acid (PFOA) compounds from its chip making processes as part of its design for the environment program. »
GM to improve manufacturing processes with help from HP and Apriso
HP Enterprise Services has been selected by General Motors to implement an Apriso solution for better control over its battery manufacturing and supply chain operations at its new Chevrolet Volt battery assembly plant. »
Large-LCD panel makers face double whammy: profitability issues, LED shortages
As large LCD panel suppliers continue to struggle to maintain profitability, many are forced to cut materials and components costs despite high growth in this market over the past few years, reports iSuppli. Adding to the challenge is a global shortage of LEDs, primarily impacting large-screen LCD TVs, which may continue throughout the year... »
Samsung mass produces 4-Gbit DDR3 DRAM
Samsung has started volume production of the industry's first low-power 4-Gbit DDR3 devices using 40-nm process technology. The high-density memory is expected to deliver significant power savings to data centers, server systems and high-end notebooks. »
Ford breaks from tradition; outsources to EMS provider
With the introduction of the company's second-generation SYNC system, the MyFord platform, Ford Motor Company also marks a change in the company's supplier strategy to using an electronics manufacturing services (EMS) provider to make the system, reports iSuppli. »
Component supply constraints hinder ‘full-throttle’ EMS growth, says iSuppli
Although the global electronics contract manufacturing industry will return to growth in 2010, the market still faces major uncertainties this year, according to the latest report from iSuppli Corp. Hurdles include component shortages, high unemployment, waning stimulus efforts and more than a trillion dollars in residential and commercial mortgage resets. »
Jabil to demo breakthrough mobility technologies
Jabil Circuit plans to demo several new components and technologies at the Mobile World Congress in Barcelona that the company says will provide critical differentiation, cost efficiencies and faster time to market for the mobility industry. »
Philips Lumileds offers full traceability for power LEDs
Aimed at customers in the automotive and consumer electronics markets, Philips Lumileds has implemented complete forward and backward traceability for its LUXEON power LED products. The company says it is now possible to identify to the wafer level exactly when, where, and how each of the hundreds of millions of LUXEON LEDs was manufactured.... »
Semiconductor equipment buys to rebound in 2010, says iSuppli
Global spending on semiconductor manufacturing equipment is expected to rise by 46.8 percent in 2010 compared in 2009, aided by the chip industry's lean supply chain, bringing an end to three consecutive years of decline, reports market researcher iSuppli Corp. »
Enel, Sharp, ST to form largest solar panel plant in Italy
Enel Green Power, Sharp and STMicroelectronics have signed an agreement for the manufacture of triple-junction thin-film photovoltaic panels in Italy, touted as the largest photovoltaic panel manufacturing plant in the country. »
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick.
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.