FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Manufacturing Trends
Flextronics beefs up clean-tech biz
Aimed at strengthening its solar module manufacturing business, Flextronics has dedicated one-million-square-feet to create a Clean Tech Super Site at its existing facility in Port of Tanjung Pelepas (PTP) Malaysia. It also complements its service offerings to OEMs of inverters, wind power, smart grid, smart metering, and energy-efficient lightning solutions. »
Novellus, IBM form 3-D TSV partnership
Aimed at advanced product applications that call for small form factors and low-power consumption, Novellus Systems and IBM Corp. are working on a joint development program to design a copper-based 3-D semiconductor through-silicon via (TSV) process leveraging Novellus' SABRE copper electroplating and VECTOR PECVD systems. »
IPC calls for revised RoHS Directive based on science, aligned with REACH
IPC -- Association Connecting Electronics Industries is urging members of the EU Council and Parliament to ensure that the revised RoHS Directive be scientifically based and fully aligned with the REACH Regulation, according to the organization's new white paper. »
Applied Materials expands display, solar equipment manufacturing
Applied Materials, a supplier of equipment to the semiconductor, flat panel display (FPD) and solar photovoltaic (PV) industries, recently opened its newly expanded Tainan Manufacturing Center in Tainan, Taiwan. »
IBM is first IC maker to eliminate PFOS and PFOA in supply chain
IBM has eliminated perfluorooctane sulfonate (PFOS) and perfluorooctanoic acid (PFOA) compounds from its chip making processes as part of its design for the environment program. »
GM to improve manufacturing processes with help from HP and Apriso
HP Enterprise Services has been selected by General Motors to implement an Apriso solution for better control over its battery manufacturing and supply chain operations at its new Chevrolet Volt battery assembly plant. »
Large-LCD panel makers face double whammy: profitability issues, LED shortages
As large LCD panel suppliers continue to struggle to maintain profitability, many are forced to cut materials and components costs despite high growth in this market over the past few years, reports iSuppli. Adding to the challenge is a global shortage of LEDs, primarily impacting large-screen LCD TVs, which may continue throughout the year... »
Samsung mass produces 4-Gbit DDR3 DRAM
Samsung has started volume production of the industry's first low-power 4-Gbit DDR3 devices using 40-nm process technology. The high-density memory is expected to deliver significant power savings to data centers, server systems and high-end notebooks. »
Ford breaks from tradition; outsources to EMS provider
With the introduction of the company's second-generation SYNC system, the MyFord platform, Ford Motor Company also marks a change in the company's supplier strategy to using an electronics manufacturing services (EMS) provider to make the system, reports iSuppli. »
Component supply constraints hinder ‘full-throttle’ EMS growth, says iSuppli
Although the global electronics contract manufacturing industry will return to growth in 2010, the market still faces major uncertainties this year, according to the latest report from iSuppli Corp. Hurdles include component shortages, high unemployment, waning stimulus efforts and more than a trillion dollars in residential and commercial mortgage resets. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »