FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Linecard Expansions
Heilind adds Corcom ultra-compact power inlet filters for telecom racks
Heilind Electronics adds Tyco Electronics' Corcom CU Series of power entry modules to its circuit protection offerings. »
TTI stocks Kemet’s high-temp COG MLCC
TTI is now stocking Kemet's new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes. »
Future inks global deal with CogniVue
Future Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement. »
Mouser offers Amphenol USB 3.0 SuperSpeed connectors
Mouser Electronics is the first to announce the availability of Amphenol's USB (Universal Serial Bus) 3.0 SuperSpeed connectors. »
Wolfson signs global agreement with Future Electronics
Wolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally. »
Newark boosts Maxim inventory for medical, industrial apps
Newark is now stocking Maxim Integrated Products' latest devices for same-day shipping at www.newark.com/maxim. A Maxim applications engineer is available to answer product questions and provide technical support at element14, a dedicated online technology portal for electronic design engineers. »
Arrow, IPS ink global distribution deal
Infinite Power Solutions (IPS) has announced a global distribution agreement with Arrow Electronics to distribute IPS' INFINERGY Micro Power Module (MPM) product family. »
Cisco selects Avnet as specialty distributor for data center products in U.S., Canada
Avnet Technology Solutions has signed a distribution agreement with Cisco to become a high-value specialty distributor for its data center products in the U.S. and Canada. Avnet will help Cisco further expand its market penetration into the data center market through qualified value-added resellers (VARs). »
Digi-Key stocks new connectors from Tyco Electronics, Weidmuller
Digi-Key is now stocking Weidmuller's DRAC line of AC Din rail receptacles and Tyco Electronics' CFP compliant Ethernet connectors and components. »
Newark beefs up frequency control line with MMD Monitor/Quartztek products
Newark has signed a franchise agreement with MMD Monitor/Quartztek to stock a wide range of high stability TCXOs and high accuracy OCXOs for same day shipping. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »