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EU research project targets energy efficiency

Tuesday, June 15, 2010
By Gina Roos

A publicly-funded European research project is targeted at developing new products and technologies aimed at energy-efficiency improvements, while advancing Europe's competitiveness. Participants include STMicroelectronics, Numonyx, NXP and ON Semiconductor. »

EU drops RoHS proposal to ban all BFRs

Friday, May 28, 2010
By Gina Roos
EU drops RoHS proposal to ban all BFRs

Due to efforts by IPC -- Association Connecting Electronics Industries to bring scientific analysis to the RoHS Directive, the European Union announced plans to drop amendments calling for a ban of all brominated flame retardants (BFRs), including tetrabromobisphenol-A (TBBPA), that have been found safe under European Union risk assessment. »

ST, Micropelt demo thermoharvesting power supply

Friday, May 28, 2010
By Gina Roos
ST, Micropelt demo thermoharvesting power supply

STMicroelectronics and Micropelt have announced a jointly-developed autonomous wireless sensor evaluation kit that combines thermal electrical harvesting with a solid-state thin-film battery. »

Acer, Dell, HP and Sony Ericsson urge the EU to ban BFRs, PVC

Tuesday, May 25, 2010
By Gina Roos

Acer, Dell, Hewlett-Packard and Sony Ericsson, together with ChemSec, Clean Production Action and the European Environmental Bureau, are calling on EU legislators to ban the use of all brominated flame retardants (BFRs) and polyvinyl chloride (PVC) in electronics put on the market from the end of 2015. »

EPA unveils tougher requirements for Energy Star TVs

Monday, May 3, 2010
By Gina Roos
EPA unveils tougher requirements for Energy Star TVs

Starting May 1, 2010, TVs that carry the Environmental Protection Agency's Energy Star label are, on average, 40 percent more efficient than conventional models. »

DA5 consortium to develop high-lead solder alternatives

Wednesday, April 21, 2010
By Gina Roos

Bosch, Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics have formed a consortium to develop alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing. The new DA5 consortium is soliciting input from die attach material suppliers to jointly evaluate and develop possible alternatives. »

Electronics firms tackle sustainability issues

Wednesday, April 21, 2010
By Gina Roos

While it may be in part due to Earth Day this week, many electronics companies -- including AMD, IBM, Motorola and UMC -- are rushing to release their corporate sustainability reports and goals, aimed at driving down both energy consumption and carbon emissions. It also impacts their supply chain. »

Ford delivers greener vehicles

Tuesday, April 20, 2010
By Gina Roos
Ford delivers greener vehicles

Ford Motor Company continues to make its vehicles more eco-friendly through an increased use of renewable and recyclable materials, including soy and bio-based seat cushions and seatbacks on the 2010 Ford Taurus. »

Premier Farnell Americas joins electronics recycling initiative

Monday, April 19, 2010
By Gina Roos

Premier Farnell's businesses in the Americas, including Newark, element14, MCM, TPC Wire & Cable and Akron Brass, have joined the Basel Action Network's new e-Stewards Initiative, aimed at ensuring that electronics waste is responsibly recycled »

IPC releases updated materials declaration standard

Wednesday, April 7, 2010
By Gina Roos
IPC releases updated materials declaration standard

IPC -- Association Connecting Electronics Industries has released its updated materials declaration standard to keep up with changes in environmental regulations including the EU's REACH regulation and China's RoHS-type regulation. It also makes the standard format easier to use. »

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