FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Green Scene
IPC calls for revised RoHS Directive based on science, aligned with REACH
IPC -- Association Connecting Electronics Industries is urging members of the EU Council and Parliament to ensure that the revised RoHS Directive be scientifically based and fully aligned with the REACH Regulation, according to the organization's new white paper. »
IBM is first IC maker to eliminate PFOS and PFOA in supply chain
IBM has eliminated perfluorooctane sulfonate (PFOS) and perfluorooctanoic acid (PFOA) compounds from its chip making processes as part of its design for the environment program. »
ECHA proposes 8 additional SVHCs
The European Chemicals Agency (ECHA) is accepting comments on eight chemicals proposed as substances of very high concern (SVHC) by three EU member states under the EU's REACH regulation. Deadline is April 22. »
DOE issues energy-efficiency metrics for data centers
The U.S. Department of Energy (DOE), together with the Environmental Protection Agency (EPA) and industry leaders, have agreed on energy-efficiency measurements, metrics, and reporting guidelines for data-center facilities. »
Eltek Valere completes power rectifier conversion to high-efficiency technology
Eltek Valere announces the availability of the Flatpack2 HE 48/3000, a 48-V, 3-kW rectifier that operates at 96 percent efficiency, marking the last of its flagship Flatpack2 rectifier products to be converted to high-efficiency (HE) versions. »
Smart meter deployment to reach 212M units in 2014
The number of smart electric meters deployed worldwide will increase from 76 million units in 2009 to about 212 million in 2014, particularly in North America and Europe, according to a study from ABI Research. »
Electronics companies, retailers to simplify ‘green’ electronics purchasing for consumers
The Sustainability Consortium, along with leading electronics companies and retailers, plans to establish a system to help consumers identify "green" electronics. Partners include Dell, HP, Intel, Toshiba, Best Buy and Walmart. Initial results will be available in the third quarter of 2010. »
Sanyo launches rechargeable DC 9-V battery for music devices
Sanyo North America Corp. has expanded its "eneloop" product family with the introduction of the eneloop music booster, a rechargeable DC 9-V battery unit for music devices. The rechargeable battery unit will be available in late spring at a target MSRP of $149.99. »
DOE awards $47M for energy-efficient IT projects
The U.S. Department of Energy (DOE) is awarding $47 million for 14 projects to support the development of new technologies that can improve energy efficiency in the information technology (IT) and communication technology sectors including data processing, data storage and telecommunications. »
Enel, Sharp, ST to form largest solar panel plant in Italy
Enel Green Power, Sharp and STMicroelectronics have signed an agreement for the manufacture of triple-junction thin-film photovoltaic panels in Italy, touted as the largest photovoltaic panel manufacturing plant in the country. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »