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	<title>Electronics Advocate &#187; Feature</title>
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	<link>http://www.electronicsadvocate.com</link>
	<description>Tracking business, design and manufacturing strategies in today's global economy</description>
	<pubDate>Thu, 11 Mar 2010 00:36:31 +0000</pubDate>
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		<title>Part 2 of 3: Trends in advanced IC packaging</title>
		<link>http://www.electronicsadvocate.com/2010/02/19/part-2-of-3-trends-in-advanced-ic-packaging/</link>
		<comments>http://www.electronicsadvocate.com/2010/02/19/part-2-of-3-trends-in-advanced-ic-packaging/#comments</comments>
		<pubDate>Sat, 20 Feb 2010 01:15:42 +0000</pubDate>
		<dc:creator>John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin</dc:creator>
		
		<category><![CDATA[Design]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[3D IC Stacking]]></category>

		<category><![CDATA[Advanced IC Packaging]]></category>

		<category><![CDATA[Advanced MEMS Packaging]]></category>

		<category><![CDATA[IBM]]></category>

		<category><![CDATA[IC]]></category>

		<category><![CDATA[IC Packaging]]></category>

		<category><![CDATA[Intel]]></category>

		<category><![CDATA[MEMS]]></category>

		<category><![CDATA[MEMS Devices]]></category>

		<category><![CDATA[MEMS Packaging]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=2640</guid>
		<description><![CDATA[Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.]]></description>
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		<item>
		<title>Part 1 of 3: Trends in advanced IC packaging</title>
		<link>http://www.electronicsadvocate.com/2010/02/16/part-1-of-3-trends-in-advanced-ic-packaging/</link>
		<comments>http://www.electronicsadvocate.com/2010/02/16/part-1-of-3-trends-in-advanced-ic-packaging/#comments</comments>
		<pubDate>Wed, 17 Feb 2010 00:29:44 +0000</pubDate>
		<dc:creator>John H. Lau, Cheng Kuo Lee, C. S. Premachandran, Yu Aibin</dc:creator>
		
		<category><![CDATA[Design]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[3D IC Stacking]]></category>

		<category><![CDATA[Advanced IC Packaging]]></category>

		<category><![CDATA[Advanced MEMS Packaging]]></category>

		<category><![CDATA[IBM]]></category>

		<category><![CDATA[IC]]></category>

		<category><![CDATA[IC Packaging]]></category>

		<category><![CDATA[Intel]]></category>

		<category><![CDATA[MEMS]]></category>

		<category><![CDATA[MEMS Devices]]></category>

		<category><![CDATA[MEMS Packaging]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=2530</guid>
		<description><![CDATA[Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 &#038; 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2010/02/16/part-1-of-3-trends-in-advanced-ic-packaging/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Analysts take on Apple&#8217;s iPad</title>
		<link>http://www.electronicsadvocate.com/2010/01/29/analysts-take-on-apples-ipad/</link>
		<comments>http://www.electronicsadvocate.com/2010/01/29/analysts-take-on-apples-ipad/#comments</comments>
		<pubDate>Fri, 29 Jan 2010 20:52:56 +0000</pubDate>
		<dc:creator>Gina Roos</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[Apple]]></category>

		<category><![CDATA[Apple IPad]]></category>

		<category><![CDATA[Dale Ford]]></category>

		<category><![CDATA[DisplaySearch]]></category>

		<category><![CDATA[E-Readers]]></category>

		<category><![CDATA[Egil Juliussen]]></category>

		<category><![CDATA[Electronics Advocate]]></category>

		<category><![CDATA[In-Stat]]></category>

		<category><![CDATA[IPad]]></category>

		<category><![CDATA[ISuppli]]></category>

		<category><![CDATA[Jagdish Rebello]]></category>

		<category><![CDATA[Market Analysts]]></category>

		<category><![CDATA[MIDs]]></category>

		<category><![CDATA[Networks]]></category>

		<category><![CDATA[Notebooks]]></category>

		<category><![CDATA[Peter King]]></category>

		<category><![CDATA[Smart Books]]></category>

		<category><![CDATA[Stephanie Ethier]]></category>

		<category><![CDATA[Tablet PCs]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=2333</guid>
		<description><![CDATA[The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2010/01/29/analysts-take-on-apples-ipad/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Managing design and supply complexity in automotive electrical/electronic systems</title>
		<link>http://www.electronicsadvocate.com/2010/01/05/managingcomplexity/</link>
		<comments>http://www.electronicsadvocate.com/2010/01/05/managingcomplexity/#comments</comments>
		<pubDate>Tue, 05 Jan 2010 18:55:52 +0000</pubDate>
		<dc:creator>Chris Burns, Director, Global Innovation, E/E Architecture and Core Engineering, Delphi Packard Electrical/Electronic Architecture</dc:creator>
		
		<category><![CDATA[Automotive]]></category>

		<category><![CDATA[Design]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[Supply Chain]]></category>

		<category><![CDATA[Airbags]]></category>

		<category><![CDATA[Automotive Engineers]]></category>

		<category><![CDATA[Chris Burns]]></category>

		<category><![CDATA[Connector]]></category>

		<category><![CDATA[Delphi]]></category>

		<category><![CDATA[Design Chain]]></category>

		<category><![CDATA[E/E Architecture]]></category>

		<category><![CDATA[Electronic Components]]></category>

		<category><![CDATA[Electronic Module]]></category>

		<category><![CDATA[Electronic Parts]]></category>

		<category><![CDATA[Electronic System Controls]]></category>

		<category><![CDATA[Electronics]]></category>

		<category><![CDATA[Infotainment Systems]]></category>

		<category><![CDATA[Inventory]]></category>

		<category><![CDATA[Logistics]]></category>

		<category><![CDATA[Manufacturing]]></category>

		<category><![CDATA[Powertrain]]></category>

		<category><![CDATA[Suppliers]]></category>

		<category><![CDATA[Vehicle E/E Architecture]]></category>

		<category><![CDATA[Vehicle Systems]]></category>

		<category><![CDATA[Wiring]]></category>

		<category><![CDATA[Wiring Assemblies]]></category>

		<category><![CDATA[Wiring Harnesses]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=2135</guid>
		<description><![CDATA[Managing complexity:  it's not as tangible as a cable, connector, electrical center, or electronic module, but it is one of the critical services electrical/electronic (E/E) architecture suppliers like Delphi provides alongside these intricate components and systems. Without it, serious problems can result in terms of design, quality and delivery. With it, the right parts are manufactured and delivered for the right applications every time -- on time and with the highest level of quality.]]></description>
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		</item>
		<item>
		<title>Top 15 articles for 2009</title>
		<link>http://www.electronicsadvocate.com/2009/12/24/top-15-articles-for-2009/</link>
		<comments>http://www.electronicsadvocate.com/2009/12/24/top-15-articles-for-2009/#comments</comments>
		<pubDate>Thu, 24 Dec 2009 17:01:16 +0000</pubDate>
		<dc:creator>Gina Roos</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[Aspen Avionics]]></category>

		<category><![CDATA[Avnet]]></category>

		<category><![CDATA[BOM]]></category>

		<category><![CDATA[Capacitors]]></category>

		<category><![CDATA[DDR2]]></category>

		<category><![CDATA[DDR3]]></category>

		<category><![CDATA[Development Kits]]></category>

		<category><![CDATA[DRAM]]></category>

		<category><![CDATA[Efficiency]]></category>

		<category><![CDATA[Electronics Advocate]]></category>

		<category><![CDATA[EMI Filters]]></category>

		<category><![CDATA[Gartner]]></category>

		<category><![CDATA[IPhone]]></category>

		<category><![CDATA[ISuppli]]></category>

		<category><![CDATA[Linear Motion]]></category>

		<category><![CDATA[Microchip]]></category>

		<category><![CDATA[Motor Control]]></category>

		<category><![CDATA[NAND]]></category>

		<category><![CDATA[NAND Memory]]></category>

		<category><![CDATA[PFC]]></category>

		<category><![CDATA[Power Semiconductor]]></category>

		<category><![CDATA[Pricing]]></category>

		<category><![CDATA[Recession]]></category>

		<category><![CDATA[Semiconductor]]></category>

		<category><![CDATA[SigmaQuest]]></category>

		<category><![CDATA[Spartan-6 FPGA]]></category>

		<category><![CDATA[THD]]></category>

		<category><![CDATA[Top 15 Articles]]></category>

		<category><![CDATA[Wireless Handsets]]></category>

		<category><![CDATA[Xilinx]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=2034</guid>
		<description><![CDATA[I would like to thank all our readers and advertisers for your support during the launch of Electronics Advocate this year. Here's a list of our top fifteen stories of 2009 (from Aug. to Dec.). Wishing you all a happy holiday season and prosperous New Year!]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2009/12/24/top-15-articles-for-2009/feed/</wfw:commentRss>
		</item>
		<item>
		<title>&#8220;Green&#8221; is the new gold</title>
		<link>http://www.electronicsadvocate.com/2009/12/02/green-is-the-new-gold/</link>
		<comments>http://www.electronicsadvocate.com/2009/12/02/green-is-the-new-gold/#comments</comments>
		<pubDate>Wed, 02 Dec 2009 20:12:45 +0000</pubDate>
		<dc:creator>Gina Roos</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[Green Scene]]></category>

		<category><![CDATA[Renewable Energy]]></category>

		<category><![CDATA[Cables]]></category>

		<category><![CDATA[Displays]]></category>

		<category><![CDATA[DisplaySearch]]></category>

		<category><![CDATA[Eco-Friendly]]></category>

		<category><![CDATA[Electronic Components]]></category>

		<category><![CDATA[Electronics Industry]]></category>

		<category><![CDATA[Energy Star]]></category>

		<category><![CDATA[Green IT]]></category>

		<category><![CDATA[Green Markets]]></category>

		<category><![CDATA[IDC]]></category>

		<category><![CDATA[Interconnects]]></category>

		<category><![CDATA[Juniper Research]]></category>

		<category><![CDATA[Low Power]]></category>

		<category><![CDATA[NanoMarket]]></category>

		<category><![CDATA[NextGen Research]]></category>

		<category><![CDATA[Passives]]></category>

		<category><![CDATA[PCs]]></category>

		<category><![CDATA[Pike Research]]></category>

		<category><![CDATA[Power ICs]]></category>

		<category><![CDATA[Semiconductors]]></category>

		<category><![CDATA[Sensors]]></category>

		<category><![CDATA[Servers]]></category>

		<category><![CDATA[Smart Grid]]></category>

		<category><![CDATA[Solar Power]]></category>

		<category><![CDATA[Storage]]></category>

		<category><![CDATA[Supercapacitors]]></category>

		<category><![CDATA[Wind Power]]></category>

		<category><![CDATA[Wires]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=1878</guid>
		<description><![CDATA[From eco-friendly computers and displays to smart-grid and renewable energy devices, this new "green" industry may deliver tremendous growth opportunities for the electronics industry.]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2009/12/02/green-is-the-new-gold/feed/</wfw:commentRss>
		</item>
		<item>
		<title>PFC sheds light on THD</title>
		<link>http://www.electronicsadvocate.com/2009/11/25/pfc-sheds-light-on-thd/</link>
		<comments>http://www.electronicsadvocate.com/2009/11/25/pfc-sheds-light-on-thd/#comments</comments>
		<pubDate>Wed, 25 Nov 2009 16:48:18 +0000</pubDate>
		<dc:creator>Michael O'Loughlin, applications engineer, Texas Instruments</dc:creator>
		
		<category><![CDATA[Design]]></category>

		<category><![CDATA[Energy Efficient Zone]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[Analog]]></category>

		<category><![CDATA[Electronics Advocate]]></category>

		<category><![CDATA[LED]]></category>

		<category><![CDATA[PFC]]></category>

		<category><![CDATA[PFC Flyback Converter]]></category>

		<category><![CDATA[Power Factor Correction]]></category>

		<category><![CDATA[Power Management]]></category>

		<category><![CDATA[Semiconductor]]></category>

		<category><![CDATA[Texas Instruments]]></category>

		<category><![CDATA[THD]]></category>

		<category><![CDATA[TI]]></category>

		<category><![CDATA[Total Harmonic Distortion]]></category>

		<category><![CDATA[UCC28810]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=1826</guid>
		<description><![CDATA[Worldwide legislation is addressing the use of PFC in offline power supplies to conserve energy resources, forcing power-supply manufacturers to have some type of PFC in their designs. This article addresses the misconception by some designers that an input current THD of less than 10% is required.]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2009/11/25/pfc-sheds-light-on-thd/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Silicon-based EMI filters reduce cost, improve receiver sensitivity in wireless handsets</title>
		<link>http://www.electronicsadvocate.com/2009/11/12/silicon-based-emi-filters-reduce-cost-improve-receiver-sensitivity-in-wireless-handsets/</link>
		<comments>http://www.electronicsadvocate.com/2009/11/12/silicon-based-emi-filters-reduce-cost-improve-receiver-sensitivity-in-wireless-handsets/#comments</comments>
		<pubDate>Thu, 12 Nov 2009 22:12:37 +0000</pubDate>
		<dc:creator>Tim Micun, director of marketing, Mobile Protection Products, California Micro Devices</dc:creator>
		
		<category><![CDATA[Design]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[BOM Analysis]]></category>

		<category><![CDATA[California Micro Devices]]></category>

		<category><![CDATA[Ceramic]]></category>

		<category><![CDATA[Ceramic-Based EMI Filters]]></category>

		<category><![CDATA[Electronics Advocate]]></category>

		<category><![CDATA[EMI Filters]]></category>

		<category><![CDATA[ESD Protection]]></category>

		<category><![CDATA[Filter Arrays]]></category>

		<category><![CDATA[Low-Pass Filters]]></category>

		<category><![CDATA[Silicon]]></category>

		<category><![CDATA[Silicon-Based EMI Filters]]></category>

		<category><![CDATA[Tim Micun]]></category>

		<category><![CDATA[Wireless Handsets]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=1724</guid>
		<description><![CDATA[This article compares the performance and total cost of ownership of ceramic-based versus silicon-based EMI filters for wireless handsets, including a BOM analysis of two handset models conducted by California Micro Devices and iSuppli.]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2009/11/12/silicon-based-emi-filters-reduce-cost-improve-receiver-sensitivity-in-wireless-handsets/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Application-specific capacitors: A custom fit for any application</title>
		<link>http://www.electronicsadvocate.com/2009/11/05/application-specific-capacitors-a-custom-fit-for-any-application/</link>
		<comments>http://www.electronicsadvocate.com/2009/11/05/application-specific-capacitors-a-custom-fit-for-any-application/#comments</comments>
		<pubDate>Thu, 05 Nov 2009 20:27:09 +0000</pubDate>
		<dc:creator>Mark Waugh, senior product manager, Murata Electronics North America</dc:creator>
		
		<category><![CDATA[Design]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[Supply Chain]]></category>

		<category><![CDATA[Application Specific Capacitors]]></category>

		<category><![CDATA[ASCaps]]></category>

		<category><![CDATA[Automotive Electronics]]></category>

		<category><![CDATA[Bluetooth]]></category>

		<category><![CDATA[Capacitors]]></category>

		<category><![CDATA[Electronics Advocate]]></category>

		<category><![CDATA[Engineers]]></category>

		<category><![CDATA[ERB Series]]></category>

		<category><![CDATA[GJM Series]]></category>

		<category><![CDATA[GPS]]></category>

		<category><![CDATA[GQM Series]]></category>

		<category><![CDATA[MA Series]]></category>

		<category><![CDATA[Mark Waugh]]></category>

		<category><![CDATA[Medical Equipment]]></category>

		<category><![CDATA[Mobile Communications]]></category>

		<category><![CDATA[Murata Electronics]]></category>

		<category><![CDATA[PDAs]]></category>

		<category><![CDATA[RF Designs]]></category>

		<category><![CDATA[RKE]]></category>

		<category><![CDATA[Surface Mount Capacitors]]></category>

		<category><![CDATA[Telecommunications]]></category>

		<category><![CDATA[Wireless]]></category>

		<category><![CDATA[WLAN]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=1636</guid>
		<description><![CDATA[We have all heard the tagline, "there's an app for that."  Not only is it catchy, but it demonstrates how we as consumers are now looking for specific, not general, products that meet a variety of our needs. As engineers we are no different, trying to find new ways to customize and tailor solutions for certain industries. A perfect example of this evolution can be found in capacitors, which first provided basic electrical storage needs in radios and are now being modified to meet select criteria in everything from automotive electronics to medical diagnostic equipment. ]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2009/11/05/application-specific-capacitors-a-custom-fit-for-any-application/feed/</wfw:commentRss>
		</item>
		<item>
		<title>Weathering the recession storm, Part 4</title>
		<link>http://www.electronicsadvocate.com/2009/11/02/weathering-the-recession-storm-part-4/</link>
		<comments>http://www.electronicsadvocate.com/2009/11/02/weathering-the-recession-storm-part-4/#comments</comments>
		<pubDate>Mon, 02 Nov 2009 18:55:15 +0000</pubDate>
		<dc:creator>Gina Roos</dc:creator>
		
		<category><![CDATA[Business]]></category>

		<category><![CDATA[Feature]]></category>

		<category><![CDATA[AC To DC Conversion]]></category>

		<category><![CDATA[Allan Lam]]></category>

		<category><![CDATA[Communications]]></category>

		<category><![CDATA[Computing]]></category>

		<category><![CDATA[Consumer]]></category>

		<category><![CDATA[Electronics Advocate]]></category>

		<category><![CDATA[Energy Preservation]]></category>

		<category><![CDATA[Energy Savings]]></category>

		<category><![CDATA[Energy-Saving Products]]></category>

		<category><![CDATA[Fairchild Semiconductor]]></category>

		<category><![CDATA[Industrial]]></category>

		<category><![CDATA[Inventory]]></category>

		<category><![CDATA[Mobile Computing]]></category>

		<category><![CDATA[Mobile Connectivity]]></category>

		<category><![CDATA[Plant Consolidation]]></category>

		<category><![CDATA[R&D Programs]]></category>

		<category><![CDATA[Renewable Energy]]></category>

		<category><![CDATA[Smart Grid]]></category>

		<category><![CDATA[Smart Metering]]></category>

		<category><![CDATA[Solar]]></category>

		<category><![CDATA[Wafer Fab Closures]]></category>

		<category><![CDATA[Wind]]></category>

		<guid isPermaLink="false">http://www.electronicsadvocate.com/?p=1576</guid>
		<description><![CDATA[If there is one thing that leading suppliers in the electronics industry agree on is that the downturn hit fast and steep. As a result, most suppliers moved quickly to reduce cost by consolidating plants, cutting their employee headcount, and pruning product lines. Here's our interview with Allan Lam, Fairchild Semiconductor's EVP, worldwide sales &#038; marketing, at Fairchild Semiconductor.]]></description>
		<wfw:commentRss>http://www.electronicsadvocate.com/2009/11/02/weathering-the-recession-storm-part-4/feed/</wfw:commentRss>
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