FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
EV Tracker
Eltek Valere expands into the electric-vehicle market
Eltek Valere has been selected to supply battery chargers to THINK's THINK City electric vehicle, marking the company's first move into the electric-vehicle market. Eltek Valere has traditionally delivered power-supply systems to the telecommunication industry. »
DOE closes $1.4B loan to Nissan to build EVs, advanced batteries
The DOE closes its $1.4 billion loan agreement with Nissan to retool their Smyrna, Tennessee factory to build advanced electric automobiles and an advanced battery manufacturing facility. »
GM to invest $246M in electric motors, hybrid components
General Motors will invest approximately $246 million in electric motor and electric drive manufacturing including construction of a high-volume electric drive production facility at the Baltimore Transmission plant. The automaker also manufactured its first advanced lithium-ion batteries for the Chevy Volt at the Brownstown Battery Pack Assembly plant. »
DOE closes $465M loan to Tesla Motors
The DOE has closed its $465 million loan with Tesla Motors for construction of a manufacturing facility in southern California to produce its Model S electric sedan and a power-train manufacturing facility in Palo Alto, California. »
SAE releases interface standard for hybrid/electric vehicles
SAE International has released a standard that provides a standard interface between plug-in hybrid and battery-electric vehicles, and electrical charging systems. »
Ford to invest additional $450M at Michigan plant for EV production
Ford Motor Company will invest an additional $450 million in its Michigan assembly plant, as it gets ready to build its next-generation hybrid and plug-in hybrid vehicle at the plant in 2012. The company is also moving the production of its advanced lithium-ion battery systems for the next-generation hybrid from Mexico to Michigan.... »
DOE to award $100 million for hybrid/EV battery and biofuel projects
The U.S. Department of Energy's Advanced Research Projects Agency-Energy (ARPA-E) is offering a second round of grants totaling $100 million for advanced research projects, targeted at batteries for hybrid and electric vehicles, biofuels and carbon capture technologies. Applicants need to submit a concept paper by January 10, 2010. »
PREMO, Nagares to develop smart-grid modules for green vehicles
Nagares Group, an automotive solutions provider to the automotive market, and PREMO, a manufacturer of inductive and EMC components, have announced a joint agreement to develop and produce smart-grid interface EMC modules for future electric and hybrid vehicle applications. »
Dana claims industry’s first battery cooling tech for electric vehicles
Dana Holding Corp. has developed a Long heat exchanger designed to extend battery life in hybrid and electric vehicles. The technology recently debuted on Tesla Motors' 2010 all-electric Roadster Sport. »
Fisker Automotive to reopen GM plant to build hybrid vehicles
Fisker Automotive is purchasing a former General Motors Corp. (GM) factory in Wilmington, Delaware, to produce long-range, plug-in electric hybrid vehicles. The company expects to build between 75,000 and 100,000 of the vehicles annually by 2014. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
- Archive for EA Blog »
New Products
- IRC current-sense resistors deliver high thermal performance
February 26, 2010 | 5:39 pm
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments. - Maxim PMIC integrates three regulators
February 26, 2010 | 5:25 pm
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels. - Archive for New Products »