FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
- Archive for Linecard Expansions »
Design
Avnet, Portescap, TI launch Analog eLab videocast series
Avnet Electronics Marketing, Portescap, and Texas Instruments Inc. (TI) have launched a new 10-part, videocast series covering design ideas using motor control products and solutions. »
Avnet MCU training videos deliver tips for faster programming
Avnet EMA unveils its Microcontroller Technology Spotlight series of multimedia instructional videos at its Online Technical Training Web site, delivering technology overviews and demonstrations on some of the most innovative microcontroller technology solutions in the market today. »
IMEC, Synopsys partner on 3-D stacked IC development
Synopsys and imec have announced a partnership to accelerate the development of 3-D stacked IC technologies. The partnership will leverage Synopsys' TCAD tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs) and imec's research facilities. »
Altium makes gains in N. American EDA market
Altium, a provider of electronic design software, is making headway in the North American market. The company says its North American operation alone has gained more than 500 new U.S. customers over the past 12 months for its electronics design solution Altium Designer. »
Power Integrations launches EuP standards finder
Power Integrations launches its new EuP Standards Finder, an online tool for power supply designers that matches end products to energy-efficiency requirements. The tool provides designers with immediate access to specific requirements of the European Commission's EuP Ecodesign Directive. »
Part 3 of 3: Trends in advanced IC Packaging
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »
Part 2 of 3: Trends in advanced IC packaging
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part... »
IPC APEX conference to provide solutions for lead-free challenges
IPC's technical conference will address a host of unintended consequences as a result of the lead ban in electronics devices, implemented as part of the EU's RoHS Directive about four years. Some of those issues include new defects, reliability concerns, processing issues and challenges for high-reliability sectors, says IPC. »
Part 1 of 3: Trends in advanced IC packaging
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 &... »
AVX upgrades free tantalum capacitor modeling tool
AVX upgrades its SpiTan software with new features for simulation and modeling of tantalum capacitors. The new SpiTan III software tool now includes the effects of temperature and voltage on DCL leakage current, equivalent circuits of capacitors with parameter values, and the addition of more than 80 new released codes. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- ADI delivers RF transceiver for short-range wireless systems
March 16, 2010 | 2:51 pm
ADI unveils a RF transceiver that targets short-range wireless systems in the global 2.4-GHz ISM band, supporting both IEEE 802.15.4 based protocol standards at 250 Kbits/s and proprietary protocols up to 2 Mbits/s using GFSK/FSK modulation schemes on a single chip. - ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Archive for New Products »