FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Companies to Watch
Samsung Electro-mechanics licenses Peratech’s QTC sensor technology
Peratech signs a major licensing agreement for its Quantum Tunnelling Composite (QTC) technology, which will be included in a new portfolio of pressure sensing components from Samsung Electro-mechanics (EM). The devices target mobile phone applications. »
MoSys claims breakthrough Bandwidth Engine ICs
MoSys expects the Bandwidth Engine IC to enable up to four times the throughput, two to four times the density, up to 40 percent lower power and system cost savings of up to 50 percent compared with today's alternative solutions. »
Valens to showcase HDBaseT-compliant chipset at CES 2010
Valens Semi announces the availability of the industry's first HDBaseT-compliant chipset and development kits. The company will showcase uncompressed HD multimedia distribution powered by the VS100 semiconductor product family at CES 2010. »
Quartics, DDD to demo 3D tech at CES 2010
Quartics and DDD Group plan to showcase their 3D technology -- that combines Quartics' Qvu video processor with DDD's TriDef 3D software -- for HDTVs and netbooks at the 2010 Consumer Electronics Show (CES). Quartics says the combined solution offers the first real opportunity for OEMs and ODMs to bring 3D to HDTVs... »
RFaxis claims to revolutionize wireless markets with single-chip CMOS RF front-end IC
Fabless semi company RFaxis unveils its next-generation pure CMOS RF front-end integrated circuits (RFeIC) platform. Touted as a game-changing RF front-end technology to transform the wireless connectivity market, the new platform is said to bring the industry one step closer to delivering a complete wireless radio on a single CMOS silicon die. »
Dana claims industry’s first battery cooling tech for electric vehicles
Dana Holding Corp. has developed a Long heat exchanger designed to extend battery life in hybrid and electric vehicles. The technology recently debuted on Tesla Motors' 2010 all-electric Roadster Sport. »
EcoDog beats Nokia in “greatest gadget” showdown at GadgetFest
EcoDog's FIDO Home Energy Monitoring Systems, a technology that provides room-by-room visibility of where energy dollars are spent in the home, earned top honors by both the judges and overall crowd votes at the annual GadgetFest, an event organized by CommNexus. »
Fisker Automotive to reopen GM plant to build hybrid vehicles
Fisker Automotive is purchasing a former General Motors Corp. (GM) factory in Wilmington, Delaware, to produce long-range, plug-in electric hybrid vehicles. The company expects to build between 75,000 and 100,000 of the vehicles annually by 2014. »
Boston-Power’s batteries power HP Pavilion dv8 notebook
Boston-Power, Inc. has announced that its Sonata lithium-ion battery will ship with the new HP Pavilion dv8 entertainment notebook PC. The battery improves the recharge rate by three to five times over conventional lithium-ion batteries, according to the company. »
MTI Micro improves fuel cell power density by 30%
MTI Micro has achieved a significant power milestone for its Mobion fuel cell engine by demonstrating a power density of 84 mW/cm2 while maintaining its fuel efficiency of 1800 Wh/kg or 1.4 Wh/cc. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »