FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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CES 2010 Coverage
TI to demo industry’s first contactless charging eval kit
Speeding the design of devices that can charge without wires, TI plans to demonstrate what it says is the industry's first contactless charging evaluation kit at the 2010 Consumer Electronics Show (CES) with Fulton Innovation. »
GENIVI to launch first open sourced IVI platform at CES 2010
The GENIVI Alliance, an automotive industry association driving the development and adoption of an open in-vehicle Infotainment (IVI) reference platform, will unveil the GENIVI Platform version 1.0 at the International 2010 Consumer Electronics Show (CES). »
NEC to highlight USB 3.0 technologies at CES 2010
NEC Electronics America will showcase its latest generation of universal serial bus (USB) technologies, along with other key technologies, at the 2010 Consumer Electronics Show (CES) in Las Vegas. »
TDVision, CyberLink deliver HD stereoscopic video decoding solution
TDVision Systems Inc. and CyberLink, Taiwan, will showcase their full HD 3D solutions at the 2010 Consumer Electronics Show (CES) in Las Vegas. CyberLink's PowerDVD video player software, integrated with TDVision's 2D+Delta decoding technology, delivers full HD 3D video decoding capabilities that is compatible with NVIDIA 3D Vision. »
Visteon to unveil connected car demo at CES 2010
Automotive systems provider Visteon Corp. will unveil its connected car demonstrator that delivers a flexible approach to providing Internet access in motor vehicles, including via the use of embedded phones, tethered mobile devices or USB connectivity cards, reports iSuppli Corp. »
Valens to showcase HDBaseT-compliant chipset at CES 2010
Valens Semi announces the availability of the industry's first HDBaseT-compliant chipset and development kits. The company will showcase uncompressed HD multimedia distribution powered by the VS100 semiconductor product family at CES 2010. »
Quartics, DDD to demo 3D tech at CES 2010
Quartics and DDD Group plan to showcase their 3D technology -- that combines Quartics' Qvu video processor with DDD's TriDef 3D software -- for HDTVs and netbooks at the 2010 Consumer Electronics Show (CES). Quartics says the combined solution offers the first real opportunity for OEMs and ODMs to bring 3D to HDTVs... »
CES 2010 to address tech policies
Top policymakers will address key technology issues, including broadcast to cable, broadband to wireless and telecom to satellite at the 2010 International CES trade show, according to the Consumer Electronics Association (CEA). Produced by CEA, CES 2010 is scheduled for Jan. 7-10 in Las Vegas, Nevada. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »