FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Business
HP leads ranking of Top 20 OEM semiconductor spenders
Hewlett-Packard is projected to be the top OEM semiconductor spender in 2010, spending an estimated $12.6 billion this year, compared to $10.99 billion in 2009, according to iSuppli Corp. Total semiconductor spending in 2010 among OEMs and EMS providers will record double-digit increases, according to the market researcher. »
Asia to account for 39% of smartphone shipments in 2015
Smartphone shipments to Asia are expected to more than quadruple by 2015, accounting for 39 percent of total smartphone shipments in 2015, reports IMS Research. »
Global computer storage market to grow in 2010
The global market for hard disk drives (HDDs) and optical disk drives (ODDs) used in computers is expected to climb as the PC market continues to strengthen, reports iSuppli Corp. The market researcher expects global revenue of HDD shipments to reach $27.7 million in 2010, up 18.4 percent from $23.4 billion in 2009. ODD... »
iSuppli: Semiconductor industry at most profitable level in a decade
The global semiconductor industry is more profitable than it has been at any time in the last decade, thanks to increasingly aggressive management of costs, capacity and competitive positioning, according to iSuppli Corp. »
Memory to drive IC growth in 2010; mixed pricing trends ahead
PCs and memory ICs will be the primary drivers for semiconductor revenue growth in 2010 with the market on track to reach $304 billion in 2012, according to Gartner Inc. The market researcher says rising DRAM prices, coupled with strong PC demand, will drive a 55 percent growth rate in DRAM revenue this year,... »
AuthenTec buys SafeNet’s Embedded Security Solutions Division
Boosting its security and identify management solutions portfolio, AuthenTec has acquired SafeNet, Inc.'s Embedded Security Solutions Division in a cash and stock transaction. AuthenTec will also become the exclusive worldwide supplier of SafeNet's SafeXcel security processor ICs. »
Large LCD panel prices set to rise in Q1 while LED backlight pricing falls
While pricing for LED backlights will continue to drop in 2010 due to increased production volumes and improvements in technology, pricing for large-sized LCD panels is expected to rise in the first quarter as TV and PC makers build inventories. »
FCI acquires MergeOptics
FCI, a leading manufacturer and provider of connector and cable assembly solutions, has acquired the assets of MergeOptics, a manufacturer of active optical cables (AOCs) and optical transceivers. Information Gatekeepers projects the AOC market to reach 48 million units by 2014. »
DRAM market to grow 40% in 2010, says iSuppli
iSuppli's preliminary forecast projects that the global DRAM market will reach $31.9 billion in 2010, up 40.4 percent from $22.7 billion in 2009, after three consecutive years of decline. DRAM revenues fell 3.7 percent in 2009, 25.1 percent in 2008 and 7.5 percent in 2007, according to the market researcher. »
Motorola to split into two publicly-traded companies
Motorola announced last week that it intends to separate into two independent, publicly-traded companies some time in the first quarter of 2011. IMS Research says the proposed Enterprise Mobility Solutions And Networks Group (EMSN) "is a hidden gem with a strong future ahead." »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- PI power conversion IC maximizes power efficiency across the entire load range
March 18, 2010 | 4:23 pm
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. - Intel unveils high-performance, highly secure data center processor
March 18, 2010 | 12:50 pm
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency. - Archive for New Products »