FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Business
Memory to drive IC growth in 2010; mixed pricing trends ahead
PCs and memory ICs will be the primary drivers for semiconductor revenue growth in 2010 with the market on track to reach $304 billion in 2012, according to Gartner Inc. The market researcher says rising DRAM prices, coupled with strong PC demand, will drive a 55 percent growth rate in DRAM revenue this year,... »
AuthenTec buys SafeNet’s Embedded Security Solutions Division
Boosting its security and identify management solutions portfolio, AuthenTec has acquired SafeNet, Inc.'s Embedded Security Solutions Division in a cash and stock transaction. AuthenTec will also become the exclusive worldwide supplier of SafeNet's SafeXcel security processor ICs. »
Large LCD panel prices set to rise in Q1 while LED backlight pricing falls
While pricing for LED backlights will continue to drop in 2010 due to increased production volumes and improvements in technology, pricing for large-sized LCD panels is expected to rise in the first quarter as TV and PC makers build inventories. »
FCI acquires MergeOptics
FCI, a leading manufacturer and provider of connector and cable assembly solutions, has acquired the assets of MergeOptics, a manufacturer of active optical cables (AOCs) and optical transceivers. Information Gatekeepers projects the AOC market to reach 48 million units by 2014. »
DRAM market to grow 40% in 2010, says iSuppli
iSuppli's preliminary forecast projects that the global DRAM market will reach $31.9 billion in 2010, up 40.4 percent from $22.7 billion in 2009, after three consecutive years of decline. DRAM revenues fell 3.7 percent in 2009, 25.1 percent in 2008 and 7.5 percent in 2007, according to the market researcher. »
Motorola to split into two publicly-traded companies
Motorola announced last week that it intends to separate into two independent, publicly-traded companies some time in the first quarter of 2011. IMS Research says the proposed Enterprise Mobility Solutions And Networks Group (EMSN) "is a hidden gem with a strong future ahead." »
Ford breaks from tradition; outsources to EMS provider
With the introduction of the company's second-generation SYNC system, the MyFord platform, Ford Motor Company also marks a change in the company's supplier strategy to using an electronics manufacturing services (EMS) provider to make the system, reports iSuppli. »
Samsung Electro-mechanics licenses Peratech’s QTC sensor technology
Peratech signs a major licensing agreement for its Quantum Tunnelling Composite (QTC) technology, which will be included in a new portfolio of pressure sensing components from Samsung Electro-mechanics (EM). The devices target mobile phone applications. »
iPad to drive IC growth for tablets
The Apple iPad promises to energize the emerging tablet PC segment, creating a potential semiconductor opportunity of more than $4.1 billion in 2014, reports In-Stat. Other winners include battery and display makers, according to the market research firm. »
Component supply constraints hinder ‘full-throttle’ EMS growth, says iSuppli
Although the global electronics contract manufacturing industry will return to growth in 2010, the market still faces major uncertainties this year, according to the latest report from iSuppli Corp. Hurdles include component shortages, high unemployment, waning stimulus efforts and more than a trillion dollars in residential and commercial mortgage resets. »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »