Breaking New Ground
TSMC to build fab for LED lighting
Marking the company's major move into the "green" energy market, TSMC broke ground on its new LED lighting research and development center and fab in Hsinchu Science Park. The company expects to offer LED light sources and light engines for the LED lighting industry in 2011. »
EU partnership launches research project on cooling semiconductors
A European partnership, consisting of semiconductor manufacturers, electronic design automation (EDA) suppliers, research institutions and universities, has launched a three-year project, looking at the impact of thermal effects on electronic circuits and systems. »
Novellus, IBM form 3-D TSV partnership
Aimed at advanced product applications that call for small form factors and low-power consumption, Novellus Systems and IBM Corp. are working on a joint development program to design a copper-based 3-D semiconductor through-silicon via (TSV) process leveraging Novellus' SABRE copper electroplating and VECTOR PECVD systems. »
ALLVIA embeds capacitors on silicon interposers
ALLVIA, a through-silicon via (TSV) foundry, has integrated embedded capacitors onto silicon interposers, a key interface between a silicon device and an organic or ceramic substrate needed for managing high-interconnect densities. »
IBM researchers demo fastest graphene transistor
IBM researchers reported in a published paper in Science magazine that they have demonstrated a radio-frequency (RF) graphene transistor with the highest cut-off frequency achieved for any graphene device -- 100 billion cycles/second (100 gigahertz). »
Imec, Holst deliver ultra-low-power processor for medical monitoring system
Imec and Holst Centre have announced an analog-signal processor ASIC, or what the organizations call an ASP, that reduces the overall power consumption of an ambulatory heart activity signal monitoring system by more than five times. »
MoSys claims breakthrough Bandwidth Engine ICs
MoSys expects the Bandwidth Engine IC to enable up to four times the throughput, two to four times the density, up to 40 percent lower power and system cost savings of up to 50 percent compared with today's alternative solutions. »
DOE invests $12M in solar technologies
The U.S. Department of Energy's National Renewable Energy Laboratory (NREL) will invest up to $12 million in four companies to support the development of early stage solar energy technologies and help them advance to full commercial scale. The companies are Alta Devices, Solar Junction, Tetra Sun and Semprius. »
DOE awards 1 billion+ supercomputing hours for research projects
The U.S. Department of Energy has awarded approximately 1.6 billion supercomputing processor hours to 69 cutting-edge research projects through the Innovative and Novel Computational Impact on Theory and Experiment (INCITE) program. »
DOE funds $37M in SSL projects
The DOE is funding more than $37 million to support 17 high-efficiency SSL projects. Award winners include Cree, Philips Lumileds, Universal Display and Veeco Instruments »

ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program.
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.



Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.