FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Breaking New Ground
ALLVIA embeds capacitors on silicon interposers
ALLVIA, a through-silicon via (TSV) foundry, has integrated embedded capacitors onto silicon interposers, a key interface between a silicon device and an organic or ceramic substrate needed for managing high-interconnect densities. »
IBM researchers demo fastest graphene transistor
IBM researchers reported in a published paper in Science magazine that they have demonstrated a radio-frequency (RF) graphene transistor with the highest cut-off frequency achieved for any graphene device -- 100 billion cycles/second (100 gigahertz). »
Imec, Holst deliver ultra-low-power processor for medical monitoring system
Imec and Holst Centre have announced an analog-signal processor ASIC, or what the organizations call an ASP, that reduces the overall power consumption of an ambulatory heart activity signal monitoring system by more than five times. »
MoSys claims breakthrough Bandwidth Engine ICs
MoSys expects the Bandwidth Engine IC to enable up to four times the throughput, two to four times the density, up to 40 percent lower power and system cost savings of up to 50 percent compared with today's alternative solutions. »
DOE invests $12M in solar technologies
The U.S. Department of Energy's National Renewable Energy Laboratory (NREL) will invest up to $12 million in four companies to support the development of early stage solar energy technologies and help them advance to full commercial scale. The companies are Alta Devices, Solar Junction, Tetra Sun and Semprius. »
DOE awards 1 billion+ supercomputing hours for research projects
The U.S. Department of Energy has awarded approximately 1.6 billion supercomputing processor hours to 69 cutting-edge research projects through the Innovative and Novel Computational Impact on Theory and Experiment (INCITE) program. »
DOE funds $37M in SSL projects
The DOE is funding more than $37 million to support 17 high-efficiency SSL projects. Award winners include Cree, Philips Lumileds, Universal Display and Veeco Instruments »
RFaxis claims to revolutionize wireless markets with single-chip CMOS RF front-end IC
Fabless semi company RFaxis unveils its next-generation pure CMOS RF front-end integrated circuits (RFeIC) platform. Touted as a game-changing RF front-end technology to transform the wireless connectivity market, the new platform is said to bring the industry one step closer to delivering a complete wireless radio on a single CMOS silicon die. »
National labs get $104 M in funding
The U.S. Department of Energy (DOE) has announced $104.7 million in funding from the American Recovery and Reinvestment Act for eight new projects at seven DOE National Laboratories. These projects will support research, development and testing of clean energy and efficiency technologies. »
Saft to build lithium-ion battery factory in Florida
Saft is planning to build a new lithium-ion (Li-ion) factory in Jacksonville, Florida, that will roughly generate 2779 jobs in the area over the next six years, thanks to a $95 million grant from the U.S. Department of Energy under the American Recovery and Reinvestment Act. The project is estimated to cost about $200... »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »