FEATURES
- Part 2 of 3: Trends in advanced IC packaging
February 19, 2010 | 9:15 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging. - Part 1 of 3: Trends in advanced IC packaging
February 16, 2010 | 8:29 pm
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging. - Analysts take on Apple’s iPad
January 29, 2010 | 4:52 pm
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation. 
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Linecard Expansions
- Heilind adds Corcom ultra-compact power inlet filters for telecom racks
February 25, 2010 | 1:38 pmHeilind Electronics adds Tyco Electronics’ Corcom CU Series of power entry modules to its circuit protection offerings.
- TTI stocks Kemet’s high-temp COG MLCC
February 23, 2010 | 6:45 pmTTI is now stocking Kemet’s new 200-degree C0G MLCC, targeted at applications such as down-hole exploration, aerospace engine compartments, automotive and geophysical probes.
- Future inks global deal with CogniVue
February 23, 2010 | 6:30 pmFuture Electronics and CogniVue Corp. have signed an exclusive global sales and distribution agreement.
- Mouser offers Amphenol USB 3.0 SuperSpeed connectors
February 4, 2010 | 6:42 pmMouser Electronics is the first to announce the availability of Amphenol’s USB (Universal Serial Bus) 3.0 SuperSpeed connectors.
- Wolfson signs global agreement with Future Electronics
January 28, 2010 | 8:48 pmWolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
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Automotive
GM to improve manufacturing processes with help from HP and Apriso
HP Enterprise Services has been selected by General Motors to implement an Apriso solution for better control over its battery manufacturing and supply chain operations at its new Chevrolet Volt battery assembly plant. »
DOE closes $1.4B loan to Nissan to build EVs, advanced batteries
The DOE closes its $1.4 billion loan agreement with Nissan to retool their Smyrna, Tennessee factory to build advanced electric automobiles and an advanced battery manufacturing facility. »
GM to invest $246M in electric motors, hybrid components
General Motors will invest approximately $246 million in electric motor and electric drive manufacturing including construction of a high-volume electric drive production facility at the Baltimore Transmission plant. The automaker also manufactured its first advanced lithium-ion batteries for the Chevy Volt at the Brownstown Battery Pack Assembly plant. »
DOE closes $465M loan to Tesla Motors
The DOE has closed its $465 million loan with Tesla Motors for construction of a manufacturing facility in southern California to produce its Model S electric sedan and a power-train manufacturing facility in Palo Alto, California. »
SAE releases interface standard for hybrid/electric vehicles
SAE International has released a standard that provides a standard interface between plug-in hybrid and battery-electric vehicles, and electrical charging systems. »
Auto IC market on the road to recovery in 2010
The automotive semiconductor market shows a recovery in 2010 along with steady growth for much of the decade ahead, with sales reaching $35 billion in 2017, according to a new report from Semicast. »
Ford to invest additional $450M at Michigan plant for EV production
Ford Motor Company will invest an additional $450 million in its Michigan assembly plant, as it gets ready to build its next-generation hybrid and plug-in hybrid vehicle at the plant in 2012. The company is also moving the production of its advanced lithium-ion battery systems for the next-generation hybrid from Mexico to Michigan.... »
Managing design and supply complexity in automotive electrical/electronic systems
Managing complexity: it's not as tangible as a cable, connector, electrical center, or electronic module, but it is one of the critical services electrical/electronic (E/E) architecture suppliers like Delphi provides alongside these intricate components and systems. Without it, serious problems can result in terms of design, quality and delivery. With it, the right... »
GENIVI to launch first open sourced IVI platform at CES 2010
The GENIVI Alliance, an automotive industry association driving the development and adoption of an open in-vehicle Infotainment (IVI) reference platform, will unveil the GENIVI Platform version 1.0 at the International 2010 Consumer Electronics Show (CES). »
Faurecia debuts “clean” strategy for next-gen vehicles
Faurecia is announcing its "clean" approach for next-generation vehicles at this week's LA Auto Show. The automotive supplier is aiming to reduce a vehicle's weight by up to 130 pounds by 2020, use more natural fibers and other biomaterials, reduce emissions and improve fuel savings through advances in seating, vehicle interiors, front ends and... »
EA Blog
- IPC updates January standards meetings
February 5, 2010 | 2:27 pmIPC’s latest blog provides updates on its January standards meetings including the 3-12a Metallic Foil Task Group, D-13 Flexible Circuits Base Materials Subcommittee, D-13b Flexible Circuits Covercoat Materials, 5-33b Soldermask Performance Task Groups and the D-15 Flexible Circuits Test Methods Subcommittee.
- Welcome to Electronics Advocate
August 7, 2009 | 4:27 pmWelcome to the launch of Electronics Advocate where we will deliver the latest information about business, distribution, supply chain, design and manufacturing trends.
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New Products
- ST joystick chip delivers low-power navigation to handhelds
March 10, 2010 | 3:05 pm
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. - Renesas Flash MCUs deliver energy-efficiency control systems
March 10, 2010 | 2:10 pm
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters. - Archive for New Products »