ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program. 
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.
Microsemi intros NAND SS storage in BGA
Phoenix, Ariz. — Microsemi Corp.’s Power and Microelectronics Group (formerly White Electronic Designs Corp.) has introduced a high-density single-level-cell (SLC) NAND solid-state storage solution in a single integrated plastic ball grid array (PBGA) package. In 8- and 16-GByte densities, the 27 x 22-mm package offers a 63 percent space savings over a standard CF card of comparable density.
The easy-to-integrate package consumes very little battery life when compared to hard drives and other larger form factor SSD solutions, yet provides high performing data rates, said Microsemi.
The BGA is designed specifically for use in defense and aerospace applications, providing highly reliable data storage for embedded computing in applications such as aircraft, communications and missiles.
The surface-mountable data storage device supports various PATA interface protocols, and an integrated 32-bit RISC flash controller manages wear leveling, error correction and power interruption protection. The PBGA package is constructed using eutectic tin-lead solder balls on a 1.27-mm pitch with strategically placed signals to extend device life in harsh environments, said the company.
Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.