ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program. 
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.
Intel, Nokia establish joint research lab
Oulu, Finland — Intel Corp., Nokia and the University of Oulu have opened their joint research center in Oulu, Finland. The Intel and Nokia Joint Innovation Center will initially conduct research for new mobile user experiences that could leverage the increasing processing and graphics power of mobile devices. The first research project will look at using graphical 3-D technology to create immersive mobile interfaces.
The Intel and Nokia Joint Innovation Center will employ about two dozen R&D professionals and become the latest member of Intel’s European Research Network, Intel Labs Europe.
The new lab is said to be well aligned with the MeeGo open source platform recently launched by Intel and Nokia. MeeGo provides the greatest flexibility for developing new 3-D experiences on mobile devices, according to the companies.
“The University of Oulu’s focus on future telecommunications solutions as well as electronics and photonics made it the perfect location for the Intel and Nokia Joint Innovation Center,” said Justin Rattner, Intel chief technology officer and director of Intel Labs, in a statement.
Another potential area of research could look into technologies that allow displaying a 3-D hologram of the person you are talking to on the phone, said the companies.
“3-D technology could change the way we use our mobile devices and make our experiences with them much more immersive,” said Rich Green, senior vice president and chief technical officer, Nokia, in a statement. “Our new joint laboratory with Intel draws on the Oulu research community’s 3-D interface expertise, and over time will lay down some important foundations for future mobile experiences.”
The lab will be located at the Center for Internet Excellence at the University of Oulu, and will work closely with the Oulu Urban Living Labs, which provide a unique environment for sensor research, testing and piloting technological and social innovations, according to the companies.
Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.