ESNA spoke with ReSolve, part of Arrow's newly launched reverse logistics group, which also includes Intechra, an IT asset disposition services company and Converge, an independent distributor, to discuss the importance of a reverse supply chain logistics program. 
The aftermath of Japan's earthquake last month has left the electronics supply chain struggling with production stoppages and shipment delays of electronic components and raw materials supply.
Because the DRAM market is highly volatile the current buyer's market could quickly swing into a seller's market during the second half of 2011. Buyers will need to keep an eye on several key issues.
IMEC, Synopsys partner on 3-D stacked IC development
Mountain View, Calif. — Synopsys, Inc., a provider of software and IP for semiconductor design, verification and manufacturing, and the Belgian nanoelectronics research center, imec, have announced a partnership to accelerate the development of 3-D stacked IC technologies. The partnership will leverage Synopsys’ Technology Computer-Aided Design (TCAD) finite-element method tools for characterizing and optimizing the reliability and electrical performance of through-silicon vias (TSVs) and imec’s research facilities.
3-D stacked IC complements conventional transistor scaling and allows multiple chips to be stacked and integrated into a single package. This technology is said to reduce form factor and power consumption, while increasing the bandwidth of inter-chip communication by minimizing connections through the circuit board with high parasitic capacitance.
However, similar to other innovative technologies, 3-D stacked IC technology introduces a number of new issues that can potentially impact its reliability and performance, says Synopsys.
Synopsys’ TCAD tools will be used to model the TSVs in the chip stacks to optimize performance and reliability. The silicon wafers with test structures will be manufactured and tested at imec.
“We consider the availability of Synopsys’ silicon-proven finite-element method tools to be an integral part of deploying 3-D stacked IC technology. This collaboration will speed up the development of through-silicon via technologies and will in turn facilitate the adoption of 3D stacked ICs in the semiconductor industry,” said Luc Van den hove, president and chief executive officer of imec, in a statement.
Delphi Automotive intros an aluminum cable as an alternative to more expensive copper cabling in automotive applications.