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ALLVIA embeds capacitors on silicon interposers
Sunnyvale, Calif. — ALLVIA, a through-silicon via (TSV) foundry, has integrated embedded capacitors onto silicon interposers, a key interface between a silicon device and an organic or ceramic substrate needed for managing high-interconnect densities.
3D integration with ALLVIA’s through-silicon via technology is said to enable much higher value capacitors than previously possible. The embedded capacitors have achieved capacitance values higher than 1,500 nF/cm2.
ALLVIA says the TSV technology enables the benefits of thin-film capacitors to be fully realized. TSV interposers with embedded capacitors provide the shortest electrical path between devices and power supply decoupling capacitors, says the company. As a result, TSVs with their very low inductance interconnects will achieve very high electrical performance when integrated with embedded thin-film capacitors.
Silicon TSV interposers enable interconnect pitch matching between a high-density IC chip and an organic or a ceramic substrate and provide a very low stress interconnect to Si ICs that use low-k dielectrics, says ALLVIA.
“The capacitance value of 15 nanofarads per millimeter square is not a limit of our process and we think that the integration of capacitors with TSVs and silicon interposers is a technological breakthrough. The capacitance from the die or package can now be transferred to the interposer,” said Sergey Savastiouk, CEO of ALLVIA, in a statement.
Samples and reliability data are available.
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