Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
SiliconBlue to demo iCE65 mobileFPGA at MWC
Santa Clara, Calif. — SiliconBlue Technologies will showcase the newest members of its iCE65 mobileFPGA family at Mobile World Congress (MWC), February 15-18 in Barcelona. The company also plans to demo several products showing how mobileFPGA devices enable seamless feature integration for mobile applications including smartphones, eBooks/ePaper, netbooks, MIDs and digital still cameras.
SiliconBlue recently expanded its iCE65 mobileFPGA family with the introduction of its iCE65L01 device that provides a programmable, ultra-low power, high logic-capacity alternative to fixed function ASSPs and small ASICs, says the company. The device, with 1,280 logic cells and up to 93 user I/O pins, is well-suited to support functions such as intelligent battery-life management and interrupt offload (to keep the application processor in a low-power mode as long as possible) in battery-operated handheld products.
“Battery life management is a huge challenge for designers,” said Kapil Shankar, CEO of SiliconBlue, in a statement. “Standard, fixed-function devices are insufficient to meet their needs. The iCE65L01 mobileFPGA device is the latest example in our strategy to provide a comprehensive family of devices offering the benefits of programmability and time-to-market to handheld, mobile product designers. The ASIC-like cost, high logic capacity, ultra-low power, and advanced-package technology of the iCE65 devices is a winning combination that provides the scalability required for our customers to implement features that differentiate their products.”
The iCE65L01 mobileFPGA device is available now in three packages:
VQ100, CB132 and QN84. Customers can design with these new product/package combinations using the iCEcube VHDL/Verilog-based development software.
Pricing: The iCE65L01 device in a QN84 package is priced at $0.99 for 1M units in annual volume. ES samples and software support are available now.
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. 
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency.