Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
NEC SoC delivers high-quality images for camera phones
Santa Clara, Calif. — NEC Electronics has unveiled its Camera Engine 151 (CE151) system-on-chip (SoC) that is said to deliver high-quality images for camera phones comparable to digital-still cameras (DSCs). The image-processing device also enables mobile phones to output full-HD (1080-pixel) video stream and still-image data up to 13 megapixels received by the CMOS sensor.
The Camera Engine Software Platform is designed for re-usability with an easy-to-use command-layer application-programming interface (API). The SoC also offers backward compatibility with previous CE series devices.
The latest CE series device also delivers several key improvements over previous versions. For example, the CE151 SoC offers an improved noise-reduction function that minimizes distortion caused by lenses and the latest generation 1.1-micron sensors to record still images and video frames.
By improving the noise reduction feature, the CE151 SoC also achieves advanced image stabilizing and optical compensation technologies that can be found in high-end DSCs to produce crystal-clear, well-balanced digital photos, says NEC.
The SoC also delivers reduced energy consumption of approximately 25 percent compared with the existing CE143 product offering.
The CE151 SoC implements SpeedTags technology from Scalado. This technology enables users to instantly capture multi-megapixel images without any shutter lag, giving greater freedom to photographers and enhancing a variety of camera-phone functions, including burst capturing and viewing, says NEC.
NEC Electronics says the new CE151 SoC provides a significant step toward achieving advanced DSC performance on a camera phone and enables mobile phone manufacturers to expand their product coverage beyond the traditional mobile phone market.
NEC Electronics will demo the CE151 SoC in NEC’s booth (Hall 8, Stand 8A125) at the
Mobile World Congress 2010 (MWC 2010) in Barcelona, Spain, February 15 to 18.
Availability: Available now with a projected total monthly production of 1.0 million units by April 2010.
Pricing: $40 per unit with an additional charge for technical support.
Resources: Camera Engine product offerings.
ST intros an ultra-low-power, single-chip controller IC containing all the functions necessary to control an optical finger navigation (OFN) module or optical joystick. 
Renesas unveils its family of RX62T 32-bit flash microcontrollers (MCU) that enable more energy-efficient control system designs for electric motors and inverters.