Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
Top ten videos of 2009 on Avnet OnDemand
Phoenix, Ariz. — More than 300 videos have been posted at Avnet, Inc.’s Web-based video network, Avnet OnDemand since its launch in March 2009. The site features a broad range of videos from Avnet and technology manufacturers including new products, hot trends, services and technical tutorials.
The site also features streamlined navigation and a robust search capability so viewers can find information quickly based on supplier, technology or topics, such as healthcare or virtualization. There are also direct links to online buying to purchase featured products.
Here’s a list of the top ten videos for 2009.
1. Digital Video Surveillance Kit/Analog Devices
2. Xilinx Spartan- 3A Evaluation Kit
3. Behind the Wheel — Actel Igloo
4. Meeting the Power Requirements for Xilinx Spartan-6 and Virtex-6 Families
5. Avnet TS — Avnet SolutionsPath Primer
6. TI Fusion GUI Demonstration
7. Challenges and Chances of the Energy-Using Products Directive (EUP)
8. Analog Devices BF518F FMC Development Kit
IRC offers a series of open-air current sense resistors, aimed at power electronics design engineers looking for high-current devices capable of providing current-sense and surge protection functions in high-temperature environments.
Maxim intros the MAX17122, a multiple-output power-supply IC that integrates three regulators, delivery a compact solution for TFT-LCD HDTV panels.