Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
The launch of the Apple iPad has resulted in an outpouring of opinions -- good and bad. Find out what key market analysts including DisplaySearch, In-Stat, iSuppli, and Strategy Analytics have to say about Apple's latest creation.
Microchip to buy Silicon Storage Technology
Chandler, Ariz. — Microchip Technology Inc. is acquiring Silicon Storage Technology, Inc. (SST), giving the company access to SST’s SuperFlash technology and extensive patent portfolio. The transaction will be completed early in the second quarter of 2010.
Microchip, a manufacturer of microcontroller and analog semiconductors, has signed a definitive agreement to acquire SST, a manufacturer of memory and non-memory ICs, for $2.85 per share in cash. The acquisition has been approved by the Boards of Directors of each company and is subject to approval by SST’s stockholders and other customary closing conditions.
SST announced prior to the merger agreement with Microchip that it had terminated its previously announced merger agreement with Technology Resources Holdings.
“This acquisition enables Microchip to gain earlier access to SST’s advanced technologies, as well as the ability to customize technology variants that can give us an advantage over competing technologies,” said Steve Sanghi, president and CEO, at Microchip, in a statement.
Power Integrations launches the highly integrated TOPSwitch-JX family of 16 power conversion ICs that incorporate a 725-V power MOSFET for use in flyback power supplies. 
Intel unveils its latest data center processor, the Intel Xeon Processor 5600 series that combines high security, performance and energy efficiency.