MoSys claims breakthrough Bandwidth Engine ICs
Expands business model to fabless semiconductor and IP
Sunnyvale, Calif. — MoSys, Inc. has unveiled a roadmap for its new Bandwidth Engine integrated circuit (IC), which will combine the company’s 1T-SRAM high-density embedded memory with its ultra-high-speed 10 Gigabits per second (Gbits/s) SerDes interface (I/O) technology and an arithmetic logic unit (ALU).
Claiming unparalleled bandwidth performance in next-generation networking systems for storing, manipulating and accessing packets, control information and statistics at breakthrough rates, MoSys expects the Bandwidth Engine to enable up to four times the throughput, two to four times the density, up to 40 percent lower power and system cost savings of up to 50 percent compared with today’s alternative solutions.
MoSys also announced the expansion of its overall business model to become a fabless semiconductor company supplying high-performance ICs, in addition to differentiated IP.
MoSys says the combination of the high-speed random access of a 1T-SRAM memory core with a serial I/O operating at 10 Gbits/s will enable a Bandwidth Engine device to provide up to two billion accesses per second, over twice the performance of designs using memory technologies. To further boost system performance, the on-chip ALU will allow macro functions to be performed within the Bandwidth Engine, reducing iterations between the other packet processing ICs and a Bandwidth Engine, according to the company.
MoSys is also introducing the complementary GigaChip Interface, an open, CEI-11 compatible chip-to-chip interface to enable highly efficient serial chip-to-chip communications in high-speed networking systems. The Bandwidth engine ICs will feature the GigaChip Interface, which will be designed to achieve 90 percent payload bandwidth efficiency, says the company.
MoSys is currently working with partner companies to create an ecosystem that will support the GigaChip Interface.
Click here for the formal announcement via webcast.
Availability: Samples of the first Bandwidth Engine ICs will be available in late 2010, followed by production quantities in the second quarter of 2011.

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