Wolfson signs global agreement with Future Electronics
Edinburgh, U.K. — Wolfson Microelectronics has signed a franchise agreement that makes Future Electronics its primary global distributor for all its products globally.
The new partnership is part of Wolfson’s strategy to widen its customer base and address the use of audio and mixed-signal ICs in consumer and industrial products.
Wolfson selected Future Electronics because of its expertise in technical sales, including its teams of field applications engineers in local branches across Europe, the Middle East, Africa (EMEA), the Americas and Asia, and the distributor’s System Design Centers in Egham (UK) and Montreal (Canada), which provide design services and Future-Blox development boards to customers. Wolfson also choose Future because of its turn-key design services and proof of concept designs in Asia.
Wolfson says Future Electronics also has proven capability in tracking new designs across borders. Many of the consumer and industrial products that use Wolfson devices are designed in EMEA or North America and manufactured in Asia.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
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