DOE invests $12M in solar technologies
Washington, D.C. — The U.S. Department of Energy’s National Renewable Energy Laboratory (NREL) will invest up to $12 million in four companies to support the development of early stage solar energy technologies and help them advance to full commercial scale. The companies are Alta Devices, Solar Junction, Tetra Sun and Semprius.
Companies awarded under DOE’s Photovoltaic Incubator Program will work with NREL to transition prototype and pre-commercial PV technologies into pilot and full-scale manufacturing. The anticipated subcontracts, up to $3 million each, will be awarded as 18-month phased subcontracts with payment made upon completion of project milestones, says the DOE.
Through the Recovery Act, the DOE is investing more than $117 million in developing and deploying solar energy technologies.
The four new partnership projects are as follows:
- Alta Devices, Inc. (Santa Clara, Calif.) up to $3 million: The company will focus efforts on developing an innovative high-efficiency (>20 percent), low-cost compound-semiconductor photovoltaic module, with market entry expected in 2011.
- Solar Junction Corp. (San Jose, Calif.) up to $3 million:
Solar Junction will develop a manufacturing process to produce a very high efficiency multi-junction cell that will be used by concentrating PV (CPV) manufacturers to produce lower cost CPV systems. - Tetra Sun (Saratoga, Calif.) up to $3 million: The Tetra Sun project will target back surface passivation for high efficiency crystalline silicon solar cells to develop a high efficiency low-cost C-Si solar cell.
- Semprius, Inc. (Durham, NC) up to $3 million: Working on a massively parallel, microcell-based CPV receiver, the company combines the benefits of unique-to-solar manufacturing techniques with the performance and operational benefits of microcell concentrating photovoltaics.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge microelectromechanical systems (MEMS) packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Part 2 covers advanced IC packaging.
Here's a book excerpt from "Advanced MEMS Packaging," written by experts in the field. The book details the latest cutting-edge MEMS packaging techniques such as low-temperature bonding and 3-D packaging. It can certainly serve as a valuable reference for those faced with the challenging problems created by MEMS devices and packaging. Parts 1 & 2 cover advanced IC packaging, while part 3 addresses advanced MEMS packaging.
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